A component carrier including a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component embedded in the stack, and a heat removal body configured for removing heat from the component is connected to the stack and preferably to the component. The heat removal body including a component-sided first heat removal structure thermally coupled with the component, and a second heat removal structure thermally coupled with the first heat removal structure and facing away from the component.

What is provided is a damping arrangement for power electronics applications having a circuit board, and a current sensor electrically connected to the circuit board, which current sensor is held in a current sensor housing, and an electrical contact pin passing through the circuit board and surrounded by the current sensor housing, wherein a damping element is arranged between the current sensor housing and the electrical contact pin.

An electronic device includes a circuit board, an electronic component, and an insulating member. The electronic component includes: a component main body that faces the circuit board; and a first lead terminal that is connected to the circuit board. The insulating member includes a base portion, a mounting portion, and an insulating wall. The mounting portion is disposed on the base portion, and is mounted to the circuit board. The insulating wall protrudes from the base portion, and is disposed between the first lead terminal and a conductive member that is positioned so as to be adjacent to the first lead terminal.

A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).

An electronic device includes a circuit board, an electronic component, and an insulating member. The electronic component includes: a component main body that faces the circuit board; and a first lead terminal that is connected to the circuit board. The insulating member includes a base portion, a mounting portion, and an insulating wall. The mounting portion is disposed on the base portion, and is mounted to the circuit board. The insulating wall protrudes from the base portion, and is disposed between the first lead terminal and a conductive member that is positioned so as to be adjacent to the first lead terminal.

What is provided is a damping arrangement for power electronics applications having a circuit board, and a current sensor electrically connected to the circuit board, which current sensor is held in a current sensor housing, and an electrical contact pin passing through the circuit board and surrounded by the current sensor housing, wherein a damping element is arranged between the current sensor housing and the electrical contact pin.

A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).

According to one embodiment, a printed circuit board includes a first conductive layer on an insulating layer, including connection pads, a first mounting pad, a second mounting pad, a second wiring connecting the first mounting pad and one of the connection pads, and a first reinforcing pattern extending from the second mounting pad, a second conductive layer on another surface of the insulating layer, including a third wiring connected to one of the connection pads, and a conductive via connecting the second mounting pad and the third wiring. The second conductive layer includes a pad portion on the third wiring, opposed to the second mounting pad, and a third reinforcing pattern extending from the pad portion and opposed to the first reinforcing pattern.

A wiring body disposed above a substrate including a conductor including: a via electrode provided in a via hole formed in an insulating layer above the substrate and connected to the conductor through the via hole; and wiring provided above the substrate with the insulating layer interposed therebetween. A lower layer included in the via electrode and located above the insulating layer and a lower layer included in the wiring include the same material.

A wiring substrate includes a substrate, conductor wiring provided on the substrate, and an insulator positioned on at least a part of the periphery of the conductor wiring, in which the insulator contains a magnetic material. The wiring substrate ensures little loss in transmission even in high-frequency band.