The disclosure provides a magnetic element and a power supply module. The magnetic element includes a first and second magnetic column, a first winding formed by sequentially connecting a first upper metal part, a first left metal part, a first middle metal part and a first right metal part, and a second winding formed by sequentially connecting a second middle metal part, a second left metal part, a first lower metal part and a second right metal part sequentially connected. The first left/middle/right metal parts and the second left/middle/right metal parts are formed on a first substrate having a first upper and lower groove in which the first and second magnetic columns are disposed respectively. The magnetic element and the power supply module in the application use circuit boards having symmetric groove structures, the process is simple, thereby facilitating panel production mode, easy for automation, and lowering cost.

A magnetic element includes a first magnetic column, a second magnetic column, a first winding wound around the first magnetic column, and a second winding wound around the second magnetic column. The first winding includes a first horizontal winding, a second horizontal winding, a first vertical winding, and a second vertical winding. The second winding includes a third horizontal winding, a fourth horizontal winding, a third vertical winding, and a fourth vertical winding. The first vertical winding and the third vertical winding are disposed on or in a first circuit board and a second circuit board respectively, the second vertical winding and the fourth vertical winding are disposed on or in a third circuit board. The first circuit board, the first magnetic column, the third circuit board, the second magnetic column, and the second circuit board are sequentially bonded to form a pre-package.

An inductor built-in substrate includes a core substrate having openings and first through holes, a magnetic resin filled in the openings and having second through holes, first through-hole conductors formed in the first through holes respectively such that each of the first through-hole conductors includes a metal film, and second through-hole conductors formed in the second through holes respectively such that each of the second through-hole conductors includes a metal film and that the metal film in each of the first through-hole conductors has a thickness that is greater than a thickness of the metal film in each of the second through-hole conductors.

An electrical assembly may include an electrically conductive first member, a magnetic second member, and/or a housing molded on the first member and the second member. A method of assembling an electrical assembly may include disposing the first member in contact with a first mold, disposing the second member in contact with the first mold, moving a second mold into contact with the first mold, and/or inserting a housing material (e.g., liquid plastic) into the first mold and the second mold to form the housing.

A magnetic inlay includes a magnetic matrix and a plurality of electrically conductive vertical through connections extending vertically through the magnetic matrix. Further, a component carrier including the magnetic inlay and a method of manufacturing said magnetic inlay are described.

A magnetic inlay for a component carrier includes a magnetic matrix and an electrically conductive structure embedded horizontally in the magnetic matrix. The electrically conductive structure is configured as an inductive element. The magnetic inlay is configured so that, depending on the geometrical properties of the electrically conductive structure, a specific inductance value is provided for the magnetic inlay.

A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a magnetic element assembled to the stack. The magnetic element includes a magnetic matrix and an inductive element. The inductive element is at least partially enclosed by the magnetic matrix, so that an electric current flow direction through the inductive element is essentially in a horizontal direction with respect to the stack. Further, a magnetic inlay and a manufacturing method are described.

A magnetic wiring circuit board includes an insulating layer; a wire disposed on a one-side surface in a thickness direction of the insulating layer and having a one-side surface in the thickness direction disposed to face the one-side surface in the thickness direction of the insulting layer at spaced intervals thereto, an other-side surface in the thickness direction in contact with the one-side surface in the thickness direction of the insulating layer, and side surfaces each connecting an end edge of the one-side surface in the thickness direction to an end edge of the other-side surface in the thickness direction; and a magnetic layer containing a magnetic particle having a shape of an aspect ratio of 2 or more and embedding the wire.

According to one configuration, a fabricator fabricates a core of a circuit component to include magnetic permeable material. The fabricator further produces the circuit component to include multiple electrically conductive paths extending through the core of the magnetic permeable material. In one arrangement, the multiple electrically conductive paths include a first electrically conductive path and a second electrically conductive path. The fabricator fabricates the circuit component and, more specifically, the core of the magnetic permeable material to include at least one cutaway portion operative to reduce inductive coupling between the first electrically conductive path and the second electrically conductive path disposed in the core.