Disclosed herein are unitary printed circuit boards (PCBs) and methods of using them for testing an integrated circuit (IC). In some embodiments, a unitary PCB comprises a main board portion and a flexible PCB portion, which are configured to be detached from each other at a separation location on the unitary PCB. The main board portion comprises a plurality of pads, and the flexible PCB portion comprises a plurality of through-holes, where a layout of the through-holes corresponds to a layout of the plurality of pads. In some embodiments, a method of testing an IC of a device comprises separating the unitary PBC into a main board portion and a flexible PCB portion, attaching the IC to the main board portion, soldering the main board portion to a platform PCB of the device, and attaching the flexible PCB portion to the main board portion.

A method of manufacturing a component carrier includes forming a poorly adhesive structure on at least one layer structure, thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure, thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure, and forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure.

A reliable electronic circuit board is provided, which maintains the quality and electrical conduction of an electronic circuit thereof even if being produced at an ordinary temperature at an atmospheric pressure. The electronic circuit board includes an ink receiving layer formed from a resin composition containing a polyvinyl acetal resin as a main component, and an electronic circuit formed in a pattern from an electrically conductive ink. An electronic circuit board production method includes the steps of: applying a liquid resin composition containing a polyvinyl acetal resin as a main component to form a layer of the liquid resin composition; heat-drying the liquid resin composition to form an ink receiving layer; and forming an electronic circuit in a predetermined circuit pattern from an electrically conductive ink by a printing method or a transferring method.

A lighting strip has a printed circuit board with one or more perforated lines at which the printed circuit board length may be adjusted by breaking off an end portion of the printed circuit board. A first layer has a first set of conductive tracks and a second layer has a second set of conductive tracks corresponding to the first set of conductive tracks. Each conductive track of the second set is vertically aligned and positioned over the corresponding conductive track of the first set. An array of contact terminals is provided on a third layer. A plurality of lighting elements is disposed along the lighting strip, each electrically connected to a respective pair of the contact terminals. The lighting strip further comprises a set of vias connecting each conductive track of the first set to the corresponding conductive track of the second set.

A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.

An electronic assembly and a manufacturing method thereof are provided. The electronic assembly includes a carrier substrate including a flexible structure and a circuit structure, and an electronic device disposed on the circuit structure. The flexible structure includes a first dielectric layer and a conductive pattern overlying thereon. The circuit structure includes a second dielectric layer overlying the first dielectric layer and the conductive pattern, and a circuit layer disposed on and passing through the second dielectric layer to be in contact with the conductive pattern, the first flexible structure includes a first portion embedded in the circuit structure and a second portion connected to the first portion and extending out from an edge of the circuit structure. The electronic device includes chip packages electrically coupled to the flexible structure through the circuit structure, and is sized to substantially match a size of the first portion of the circuit structure.

A diagonally cuttable LED strip system comprising of a channel having a bottom and one or more side walls and a lens in which a primary circuit board having one or more LED diodes, one or more resistors, and one or more cutting lines resides therein. The one or more cutting lines include perpendicular and non-perpendicular cutting lines which divide the channel into cuttable increments at one or more angles. An extender is provided which attaches to the end of a channel to allow the cuttable increments of the channel to be extended, shortened, or a combination thereof.

A method of manufacturing a component carrier includes: (i) embedding a poorly adhesive structure in a stack, wherein the stack comprises at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) forming a cavity in the stack by removing a stack piece, wherein the stack piece is in part delimited by the poorly adhesive structure; and (iii) selectively exposing a bottom of the cavity by partially removing the poorly adhesive structure. A corresponding component carrier includes analogous features.

A method for manufacturing a wiring board includes forming on a first support plate a first laminated wiring portion including conductor and insulating layers such that the first portion has a first surface on first support plate side and a second surface, separating the first portion from the first plate, forming a conductor layer exposed on the first surface and including pads, laminating the first portion on a second support plate such that the second surface of the first portion faces second support plate side, forming on the first surface of the first portion a second laminated wiring portion including conductor and insulating layers such that the second portion has a third surface on second support plate side and a fourth surface, forming cavity in the second portion on the second plate such that the cavity exposes the pads, and separating the first and second portions from the second plate.

A circuit board enclosure comprises a circuit breaker, platform, base, cover, and circuit board. The circuit breaker includes two conductors and a plate, which is connected to the conductors. The platform receives the circuit breaker. The base has a bottom member and an opening arranged in the bottom member. The base receives the platform with the circuit breaker such that the plate of the circuit breaker is accommodated substantially within the opening of the bottom member. The cover is configured to cover the base and form an interior space. The interior space accommodates the platform, the circuit breaker, and the circuit board. The circuit board is connected to the circuit breaker. The circuit board enclosure can be adhered to a substantially planar surface. The plate is configured such that removal of the circuit board enclosure from the substantially planar surface will damage the connection of the plate to the conductors.