A strap connector includes an insulating body, a conductive element, a locking member, a pressing block, and a strap connected with the pressing block. The locking member includes a main body portion and a locking elastic arm. The main body portion includes a top plate. The locking elastic arm extends from the top plate and is used for locking with a mating connector. The pressing block is slidable backwardly under the pulling of the strap, so that the pressing block presses the top plate downwardly, and then the locking elastic arm moves downwardly to realize unlocking. When the unlocking method disclosed in the present disclosure is performed, it is only necessary to ensure that the pressing block slides over the top plate, which improves the reliability of unlocking.

According to examples, a memory module with module rows of conductive contacts can enable multiple memory channels to be connected to the same memory module. In one example, a memory module includes a printed circuit board (PCB) having a first face, a second face, and an edge to be received by a connector. The memory module includes a plurality of memory chips on at least one of the first and second faces of the PCB. The memory module includes two or more rows of conductive contacts on each of the first and second faces of the PCB, the two rows including a first row of conductive contacts proximate to the edge of the PCB to be received by the connector, and a second row of conductive contacts between the first row and a second edge of the PCB opposite to the first edge.

According to one embodiment, in a semiconductor storage device, a conductive cover is provided on a side of the principal surface, and covers at least a part of the memory and the controller. A substrate has a first notched portion and a second notched portion in an outer edge. The conductive cover has a top plate portion, a first side plate portion, a second side plate portion, a first claw portion, and a second claw portion. The first claw portion is extended from a lower end of the first side plate in a direction intersecting with the principal surface. The first claw portion is fitted into the first notched portion. The second claw portion is extended from a lower end of the second side plate in the direction intersecting with the principal surface. The second claw portion is fitted into the second notched portion.

An electronic device is provided, including a first circuit board, a second circuit board, a supporting member, and a first locking member. The first circuit board has a first hole. The second circuit board has a second hole, a pin, and a metal connector, wherein the pin is connected to the first circuit board. The supporting member has a first portion disposed in the first hole, a second portion, and a screw hole extending from the first portion to the second portion, wherein the diameter of the first portion is less than that of the second portion. The first locking member passes through the second hole and enters the screw hole to affix the second circuit board to the supporting member. The second portion is disposed between the first circuit board and the second circuit board to form a gap therebetween.

A battery pack includes: a housing (18); one or more battery cells (12) housed inside the housing; one or more seat surfaces (52a, 54a, 56a, 58a) disposed inside the housing; a circuit board (16), which is housed inside the housing and is mounted on the seat surface(s); and one or more terminals (20b, 22b) electrically connected to the circuit board. One or more elastic sheets (60, 62) surround(s) the perimeter(s) of the terminal(s) and is (are) interposed between the circuit board and the seat surface(s).

Provided is a wiring board including a substrate formed of an insulation material, and plural conductive patterns including plural electrodes arranged on a surface of the substrate along an end surface of the substrate, and plural wiring patterns connected to the plural electrodes, respectively, wherein the substrate includes a notch formed between electrode groups each of which includes a predetermined number of the electrodes.

A connection element for an electronic component assembly includes a support, a first contact pad, and a second contact pad. The first contact pad and the second contact pad are electrically connected. A first contact conductor has a first conductor surface electrically connected to the first contact pad at a first section, and is configured to form a welded connection in a second section of the first conductor surface, and/or on the second conductor surface. The invention also relates to an electronic component assembly which includes such a connection element, and which has at least one component welded to the contact conductor.

Memory devices may include a substrate supporting at least one semiconductor device thereon. The substrate may include an interface sized, shaped, and configured to provide electrical connection to the at least one semiconductor device, the interface located proximate to an end of the substrate. Engagement structures may be located proximate to, and laterally outward from, the interface. The engagement structures may extend laterally beyond a remainder of a lateral periphery of the substrate, each engagement structure comprising a first depth at a first portion of the engagement structure and a second, smaller depth at a second, laterally inward portion of the engagement structure. A carrier may include supports shaped, positioned, and configured to be positioned in the second portions of the engagement structures to secure the end of the substrate to the carrier.

A connector assembly comprises a connector including an insulating housing formed with a slot extending in a longitudinal direction and having at least one open end. A first circuit board is inserted into the slot and includes an electrical contact pad for electrically contacting a conductive terminal arranged within the slot, the electrical contact pad of the first circuit board extends in the longitudinal direction outside of the insulating housing of the connector via the open end of the slot.

Systems and techniques are described for a sensor designed to connect to and monitor devices in an ecosystem. In some implementations, a system monitors a property that includes the sensor configured to generate sensor data reflecting an attribute of the property. The sensor includes a host board that generates the sensor data and a core board connected to the host board. The core board identifies a type of the host board and communicates with a monitor control unit. The monitor control unit receives a request for firmware associated with the type of the host board from the sensor. In response, the monitor control unit accesses the firmware and transmits the firmware to the sensor. The core board of the sensor receives the firmware and stores the firmware. The core board receives the sensor data from the host board and transmits the sensor data to the monitor control unit.