A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.

The present invention relates to an improved electronic circuit, as well as an improved substrate with electronic circuits, with an identification pattern. The invention makes it possible to make them identifiable and amongst other things to retrace the circuit(s) in this way through the production process. Furthermore, the invention relates to an improved production method for circuits and substrates according to the invention.

In one aspect, a system component includes a printed circuit (PC) board on which plural conductive ink segments are disposed. The system component also includes a sealed housing that houses the PC board. The plural conductive ink segments define a bit pattern to establish a key.

A chip on film package structure including a flexible film, a patterned metal layer, a chip, a patterned solder resist layer, and a code-included pattern is provided. The flexible film comprises a chip mounting region and a peripheral region surrounding the chip mounting region. The patterned metal layer disposed on the flexible film. The chip mounted on the chip mounting region and electrically connected to the patterned metal layer. The patterned solder resist layer exposing the chip mounting region and covering a part of the patterned metal layer. The code-included pattern disposed on the peripheral region of the flexible film. The code-included pattern comprises a plurality of machine-readable data. A method for reading a code-included pattern on a package structure is also provided.

A component mounting device mounts an electronic component on a printed circuit board, and includes a sideview camera which takes an image of a side surface of a target, a mounting head having a nozzle shaft, and a driving device which moves the mounting head to a planar direction on a base. The nozzle shaft includes a shaft main body movably supported to a vertical direction with respect to the mounting head, and a suction nozzle attached at a tip of the shaft main body to suction and hold the electronic component, and an identification mark which identifies the suction nozzle is provided on a side surface of the suction nozzle.

A ceramic green sheet including a plurality of substrate forming regions. A barcode or a two-dimensional code is drawn in a portion of the ceramic green sheet. The barcode or the two-dimensional code is obtained by encoding one or more of the following information. Information relating to raw materials used when the ceramic green sheet is produced, information relating to molding conditions of the ceramic green sheet, information relating to a release agent used when a plurality of the ceramic green sheets are stacked, or a serial number.

A method of manufacturing a flexible laminate electronic device and the flexible laminate electronic device itself is disclosed. The method includes placing electronic components over a flexible substrate layer that includes electrical connections between ones of the electronic components. A first flexible additive layer that includes apertures is positioned to align ones of the electronic components in respective ones of the apertures. A subsequent flexible additive layer is arranged over the first flexible additive layer and the apertures are aligned around respective portions of ones of the electronic components protruding above the first flexible additive layer. A flexible cover layer is emplaced over the subsequent flexible additive layer.

A flexible laminate electronic device includes a flexible substrate that includes electrical connections between electronic components attached to the flexible substrate. A first flexible additive layer includes apertures, wherein at least one of the one or more electronic components is aligned in one of the apertures. A subsequent flexible additive layer is disposed over the first flexible additive layer and aligned around respective portions of the electronic components protruding above the first flexible additive layer. A flexible cover layer is placed over the subsequent flexible additive layer.

Flexible circuits are described including markings that indicate connections between their flat-wire conductors and specific circuits of a vehicle electrical system. Wire conductors within the flexible circuit share connections with different circuits of the vehicle electrical system. To indicate a connection between a wire conductor and a vehicle circuit, the flexible circuit includes one or more human or machine-readable marks specifically indicating the connection, in some cases, at a position where the connection is to be made. The marks can include etchings or printings on the wire conductors or printings on or otherwise visible from the insulating body that protects the wire conductors.

A printed wiring board includes a lower layer including conductor layers and insulating layers, a conductor layer formed on the outermost insulating layer in the lower layer, and a solder resist layer formed on the conductor layer such that the solder resist layer is covering the conductor layer on the outermost insulating layer, and a two-dimensional code structure formed on the lower layer and including the conductor layer and a portion of the solder resist layer such that the portion of the solder resist layer has openings forming exposed portions of the conductor layer and that the openings of the solder resist layer and the exposed portions of the conductor layer form the two-dimensional code structure. The conductor layer includes a portion corresponding to the two-dimensional code structure such that the portion of the conductor layer has a residual copper rate that allows the two-dimensional code structure to be read.