An electronic device, including a first circuit board, a sensing element, a second circuit board, an electronic element, a light emitting element, and a lens, is provided. The first circuit board has a first surface and a second surface opposite to each other and a first side surface located therebetween. The sensing element is disposed on the first surface and electrically connected to the first circuit board. The second circuit board is located on the second surface and electrically connected to the first circuit board. The second circuit board has a third surface facing the first circuit board and a groove recessed in the third surface. The electronic element is disposed on the second surface and located in the groove. The light emitting element is disposed on the first side surface. The lens is disposed on the sensing element. An electronic system, including the electronic device, is also provided.

A data storage device includes a memory module including a circuit board, a plurality of light emitting elements and a light guiding unit. The light emitting elements are electrically connected to the circuit board. The light guiding unit includes a light-homogenizing plate and a light output portion. The plate is disposed between the light output portion and the light emitting elements. A light diffusion space is disposed between the plate and the light output portion. The light emitted by the light emitting elements propagates sequentially into the plate, the light diffusion space, and the light output portion and then is output through the light output portion.

A PCB that constructs circuit traces, vias, and connection pads by filling recessed areas, grooves, holes, and/or counter bores with conductive material. The recessed areas are filled with conductive ink or plating solutions by a number of methods. Capillary action aids in the filling of the recessed areas. Pressure, vacuum and or gravity can aid the filling. Layers of the PCB or similar type devices can be bonded together both mechanically and electrically to accomplish 3D connections of circuits. Ground and power plane durability and conductivity is enhanced by the inclusion of small grooves over the conductive plane.

Lighting systems that include an LED and a silicone module designed to contain a lens are described herein.

An LED flexible strip lamp has a strip lamp holder, a conductive flexible strip, an LED flexible strip and a lamp cap, the LED flexible strip includes a first bonding pad disposed at its end, the conductive flexible strip includes a flexible insulating sheet, a conductive metal foil, a second bonding pad; the lamp cap includes an internal connector, and the internal connector includes an elastic conductive member abutting against the conductive metal foil. a conductive member with the bonding pad is arranged to be welded to the LED flexible strip so as to be matched with the lamp holder in an inserted mode, automation can be achieved conveniently, and the problem that an original LED flexible strip lamp is low in production efficiency due to the fact that the lamp holder needs to be installed manually is solved.

A component carrier including (a) a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure; (b) an optical component embedded within the stack, wherein the optical component comprises an optically active portion; (c) an opening formed within the stack, wherein the optical component and the opening are spatially arranged and configured such that an optical communication between the optically active portion and an exterior of the stack is enabled; and (d) a protection structure extending at least partially around the optically active portion and/or the opening. The protection structure protects the optically active portion from a resin flow during an embedding of the optical component in the stack. A method for manufacturing such a component carrier.

A circuit board for a light-emitting diode assembly includes a substrate layer, a dimming zone column disposed on one surface of the substrate layer, the dimming zone column including dimming zones, each of the dimming zones including a predetermined number of LED landing pads. The dimming zones includes a predetermined number of first dimming zones and a predetermined number of second dimming zones, a first common wiring commonly connected to the first dimming zones and disposed at a first lateral side in a row direction of the dimming zone column, a second common wiring connected to the second dimming zones and disposed at a second lateral side in the row direction opposite to the first lateral side of the dimming zone column, and an individual wiring connected to each of the dimming zones.

A method for manufacturing a circuit board includes: preparing a first substrate and a second substrate, wherein: the first substrate comprises a convex post member formed at a top surface of the first substrate, and the second substrate including a first surface and a second surface opposite to the first surface, and comprising: a first metal layer formed on at least the first surface, and an opening through which a top surface of the post member is uncovered in a plan view; bonding at least a portion of a top surface of the first substrate excluding the post member and the second surface of the second substrate so that the top surface of the post member is uncovered through the opening; and forming a circuit pattern by removing a first portion of the first metal layer.

A circuit board for a light-emitting diode assembly according to an embodiment includes a substrate layer, dimming zones formed on one surface of the substrate layer, each of the dimming zones comprising a predetermined number of LED landing pads, and a wiring bundle disposed between the dimming zones neighboring in a row direction to extend in a column direction, the wiring bundle including wirings connected to the LED landing pads at the same level.

An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.