A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.

Embodiments presented in this disclosure generally relate to techniques for interconnecting integrated circuits. More specifically, embodiments disclosed herein provide a back mounted interposer (BMI) to facilitate interconnecting of integrated circuits. One example apparatus includes an integrated circuit, an interposer, and a circuit board, at least a portion of the circuit board being disposed between the integrated circuit and the interposer, where the circuit board is configured to provide electrical connection between the interposer and the integrated circuit via connection elements on a first surface of the interposer. The apparatus also includes an interface on a second surface of the interposer, the interface being configured to provide signals from the integrated circuit to an electrical component.

An optical device may include an optical subassembly and a digital signal processor (DSP). The optical device may include a radio frequency (RF) interconnect that electrically connects the optical subassembly and the DSP. The optical device may include a passive RF filter on one or more transmission lines of the RF interconnect.

Lighting systems that include an LED and a silicone module designed to contain a lens are described herein.

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

In some embodiments, a camera actuator includes an actuator base, an autofocus voice coil motor, and an optical image stabilization voice coil motor. In some embodiments, the autofocus voice coil motor includes a lens carrier mounting attachment moveably mounted to the actuator base, a plurality of shared magnets mounted to the base, and an autofocus coil fixedly mounted to the lens carrier mounting attachment for producing forces for moving a lens carrier in a direction of an optical axis of one or more lenses of the lens carrier. In some embodiments, the optical image stabilization voice coil motor includes an image sensor carrier moveably mounted to the actuator base, and optical image stabilization coils moveably mounted to the image sensor carrier within the magnetic fields of the shared magnets, for producing forces for moving the image sensor carrier in a plurality of directions orthogonal to the optical axis.

A Printed Circuit Board (PCB) includes a via extending through at least one layer of the PCB. The PCB may also include a first catch pad connected to the via and located within a first metal layer of the PCB. The first catch pad may have a first size. The PCB may further include a second catch pad connected to the via and located within a second metal layer of the PCB. The second catch pad may have a second size greater than the first size. The second catch pad may overlap horizontally with a portion of a metallic feature in the first metal layer to obstruct light incident on a first side of the PCB from transmission to a second side of the PCB through a region of dielectric material near the via.

An image capturing assembly is provided and includes an image sensing device, a first circuit board, a second circuit board and a lens assembly. The image sensing device includes an electrical connecting component. The first circuit board includes a first contact. The image sensing device is mounted on the first circuit board, and the electrical connecting component is electrically connected to the first contact. The second circuit board includes a second contact. The second circuit board is affixed with the first circuit board and perpendicular to the first circuit board, and the second contact is electrically connected to the first contact, so that the second contact is electrically connected to the electrical connecting component by the first contact. The lens assembly is assembled with the image sensing device. Furthermore, a related endoscope is provided.

A camera module and an assembling method. The camera module comprises a lens (1), a connecting member (2), a circuit board (3), and a photoelectric imaging sensor provided on the circuit board (3). Along the direction of an optical axis, the connecting member (2) comprises a first connecting portion (21) fixedly connected to the lens (1) and a second connecting portion (22) connected to the circuit board (3); a correction plane (4) is provided on one side, facing the second connecting portion (22), of the first connecting portion (21), or a correction plane (4) is provided on one side, close to the circuit board (3), of the second connecting portion (22); the correction plane (4) is parallel to an imaging plane of the lens (1); a connecting adhesive layer (A) having a predetermined thickness is provided between the correction plane (4) and the second connecting portion (22).

A component carrier including (a) a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure; (b) an optical component embedded within the stack, wherein the optical component comprises an optically active portion; (c) an opening formed within the stack, wherein the optical component and the opening are spatially arranged and configured such that an optical communication between the optically active portion and an exterior of the stack is enabled; and (d) a protection structure extending at least partially around the optically active portion and/or the opening. The protection structure protects the optically active portion from a resin flow during an embedding of the optical component in the stack. A method for manufacturing such a component carrier.