Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

The present invention relates to an electronic device comprising a printed substrate comprising a trace of molecular ink thereon, the molecular ink being sintered to form a conductive metal trace forming the electronic device, wherein the molecular ink is chosen from a) a flake-less printable composition of 30-60 wt % of a C.sub.8-C.sub.12 silver carboxylate, 0.1-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition; or b) a flake-less printable composition of 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate, 0.25-10 wt % of a polymeric binder and balance of at least one organic solvent, all weights based on total weight of the composition.

Disclosed are methods of sintering metal nanoparticles and methods of making conductive metal films.

The invention relates to a deformable display, more in particular a flexible, stretchable, and transparent deformable display based on light-emitting elements such as for example light-emitting diodes (LEDs). The invention also relates to the use and applications of such deformable display, including systems and methods making use of such deformable display. In addition the invention relates to a flexible, stretchable and transparent display being deformable in real-time while maintaining deformability.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

A solar panel module has a flexible circuit board, a matrix of solar cells surface mounted thereto, a coverglass extending over the matrix of solar cells and the flexible circuit board bonded to a rigid support panel. The circuitry including electrical connection pads in an arrangement on the first side surface for electrical connection of the circuitry to each of the matrix of solar cells, flat bypass diodes may be disposed on the first side surface under the cells and connecting to the circuitry. Conductive adhesives adhering each of the solar cells to the flex circuit at the electrical connection pads that correlate to electrical connection points on underside of each solar cells. The first side having a plurality of standoffs for receiving each of the matrix of solar cells providing raised levels for the solar cells, the landing portions projecting outwardly from a base level surface.

A physically compliant, 3-dimensional, heterogeneously integrated system includes electronics that have a metal-oxide-semiconductor structure; plural graphene-based sensors; interconnects configured to electrically connect the electronics to the plural graphene-based sensors; and a first polymer layer that extends between the electronics and the plural graphene-based sensors so that the electronics are prevented from directly contacting the plural graphene-based sensors. The electronics, the plural graphene-based sensors, the interconnects, and the first polymer layer are configured to have a thickness that allow the entire system to bend to have a bending radius less than 10 mm.

A precursor body, of a flexible printed circuit, which is developed and provided on a bottom surface of a housing of a concentrator photovoltaic module for concentrating sunlight and generating power, includes: a plurality of strip-shaped flexible substrates extending in an X direction when one direction is defined as the X direction; a printed circuit unit including a plurality of cells mounted on the flexible substrates at equal intervals in the X direction and an electric circuit related to the cells; and a plurality of connection bands connecting the plurality of flexible substrates to each other in a state where the plurality of flexible substrates are aligned so as to be close to each other in a Y direction orthogonal to the X direction, the plurality of connection bands extending in the Y direction.

A smart key for a vehicle, including: a case part; a substrate part which is coupled to the case part and on which electronic components are mounted; a plate part which supports the substrate part; a solar power unit which is supported on the plate part and supplies power to the substrate part by means of sunlight; and a sheet part which is coupled to the case part and which covers the solar power unit, so as to be able to operate the vehicle, by way of sunlight, without replacing the battery.