The present invention relates to a solar panel to which a high-damping stacked reinforcement part is applied and, more specifically, to a solar panel to which a high-damping stacked reinforcement part is applied, comprising: a power generation unit for generating electrical energy; a coupling part to which the power generation unit is coupled, and which has a circuit formed therein; and a reinforcement part for reinforcing the rigidity of the coupling part and damping vibration to be transmitted, and thus the present invention can prevent the power generation unit from being damaged by vibration, or the solar panel from inducing wobbling of a satellite by failing to damp the vibration.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

A photovoltaic device including: a first amorphous semiconductor layer (3) and a second amorphous semiconductor layer (4) both on a back face of a semiconductor substrate (1); electrodes (5, 6); and a wiring board (8). The electrodes (5, 6) are disposed on the first amorphous semiconductor layer (3) and the second amorphous semiconductor layer (4) respectively. The wiring board (8) has wires (82) connected to the electrodes (5) by a conductive adhesive layer (7). The wiring board (8) has wires (83) connected to the electrodes (5) by the conductive adhesive layer (7). The electrodes (5) include conductive layers (51, 52). The electrodes (6) include conductive layers (61, 62). The conductive layers (51, 61) are composed primarily of silver. The conductive layers (52, 62) cover the conductive layers (51, 52) respectively. Each conductive layer (52, 62) is composed of a metal more likely to be oxidized than silver.

The invention relates to a deformable display, more in particular a flexible, stretchable, and transparent deformable display based on light-emitting elements such as for example light-emitting diodes (LEDs). The invention also relates to the use and applications of such deformable display, including systems and methods making use of such deformable display. In addition the invention relates to a flexible, stretchable and transparent display being deformable in real-time while maintaining deformability.

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

A metal foil pattern layered body of the invention includes a base member; a metal foil including a metal pattern formed by an opening and a metal portion; and a protuberance provided at the metal foil and at a boundary between the opening and the metal portion.

A substrate pad for soldering at least one self-aligning component thereon, wherein at least one edge of a body of the substrate pad is shaped to conform to a corresponding edge of a component pad, and the at least one edge of the body of the substrate pad further include a plurality of pad fingers leading away from the substrate pad. Related apparatus and methods are also described.

Disclosed is an energy harvesting apparatus which comprises: a flexible energy harvesting module having a flat plate shape; a connector which is mechanically and electrically connectable to an external connector; a rigid member having a flat plate shape; and an electric wiring constituting a part of a front surface of the rigid member, wherein an edge of a back surface of the energy harvesting module is disposed on the front surface of the rigid member, and the connector is disposed on the front surface of the rigid member at a position spaced apart from the energy harvesting module and is electrically connected to the energy harvesting module via the electric wiring.

Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

A flexible electronics assembly includes a single-piece substrate having two regions of rigidity separated by a localized region of flexibility. The localized region of flexibility has a lower rigidity than the two regions of rigidity. The two regions of rigidity are angularly deflectable from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate by hinging action of the localized region of flexibility. At least one electronic component is mounted on at least one of the two regions of rigidity.