H05K2201/1025

HEAT TRANSFER MEMBER-EQUIPPED SUBSTRATE AND METHOD FOR MANUFACTURING HEAT TRANSFER MEMBER-EQUIPPED SUBSTATE
20220408545 · 2022-12-22 ·

A heat transfer member-equipped substrate includes a heat transfer member installed in a through hole of a substrate; a heat generating component; and a solder portion soldering the heat generating component to the heat transfer member, a nickel base plating formed on the heat transfer member, and the solder portion bonded to the nickel base plating where a gold plating that suppresses oxidization of the nickel base plating is blended into the solder portion. The heat transfer member includes a first and a second heat transfer portion bonded to each other, the first heat transfer portion made of a first metal, the second heat transfer portion made of a second metal formed on at least a portion of a surface of the second heat transfer portion, and the second heat transfer portion being a plate shape that protrudes from a circumference of the first heat transfer portion.

Electronic device for determining the angular position of a motor vehicle shaft

Disclosed is an electronic device for determining the angular position of a shaft of a motor vehicle, the device including a printed circuit board and a magnetic guide including at least two fastening tabs for fastening to the printed circuit board, the printed circuit board including a base substrate and at least two fastening areas for fastening the magnetic guide, each designed to receive a fastening tab of the magnetic guide, the fastening tab defining a fastening orifice. Each fastening area is defined on the base substrate of the printed circuit board and includes a pad fastened to the base substrate. Each fastening tab is joined to the pad of the corresponding fastening area by way of an adhesive that is applied in its fastening orifice.

Wireless Headset and Headset Box
20220210535 · 2022-06-30 ·

A wireless headset includes a housing and a power system disposed in a cavity enclosed by the housing and configured to supply power to the wireless headset. The wireless headset further includes a first electrical connector and a second electrical connector disposed on the housing of the wireless headset and are respectively electrically connected to two electrodes of the power system. The housing includes a rod body and an earbud connected to a top of the rod body, wherein the first electrical connector is located at a bottom end of the rod body, and the second electrical connector is located on an outer side wall of the earbud.

CONNECTOR FOR CONNECTING AN ELECTRICAL TERMINATION ON A PRINTED CIRCUIT, CORRESPONDING ASSEMBLY METHODS

A connector for connecting an electrical termination to a printed circuit. The connector has the shape of a metal plate including: a peripheral area for fastening the connector on the printed circuit; a central orifice for inserting the electrical termination; retaining tabs for retaining the electrical termination, each retaining tab extending from the peripheral area towards the central orifice, and includes an elastically deformable portion attaching the retaining tab to the peripheral area and a free end forming an edge of the central orifice, the free end comprising a curve and a sharp edge, the curve and the sharp edge being respectively positioned opposite to each other so that the curve is oriented towards a first face, called removable assembly face, of the metal plate, and that the sharp edge is oriented towards a second face, called permanent assembly face, of the metal plate, opposite to the first face.

Resin multilayer substrate and electronic device

A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

Chip-on-board modular lighting system and method of manufacture
11092321 · 2021-08-17 · ·

Systems are described herein. A system includes a thermally conductive plate and multiple light-emitting devices (LEDs) on a surface of a substrate. The substrate is thermally coupled to the thermally conductive plate and includes first electrical power contacts on the surface. The system also includes an electronics board having second electrical power contacts. The electronics board is on the thermally conductive plate with the first and second electrical power contacts electrically coupled together and the electronics board at least partially covering the surface of the substrate on which the plurality of LEDs is disposed.

Electronic device comprising an electronic component mounted on a support substrate and assembly method

A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.

RESIN MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
20200396836 · 2020-12-17 ·

A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

ELECTRONIC DEVICE FOR DETERMINING THE ANGULAR POSITION OF A MOTOR VEHICLE SHAFT
20200331518 · 2020-10-22 ·

Disclosed is an electronic device for determining the angular position of a shaft of a motor vehicle, the device including a printed circuit board and a magnetic guide including at least two fastening tabs for fastening to the printed circuit board, the printed circuit board including a base substrate and at least two fastening areas for fastening the magnetic guide, each designed to receive a fastening tab of the magnetic guide, the fastening tab defining a fastening orifice. Each fastening area is defined on the base substrate of the printed circuit board and includes a pad fastened to the base substrate. Each fastening tab is joined to the pad of the corresponding fastening area by way of an adhesive that is applied in its fastening orifice.

Resin multilayer substrate and electronic device

A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.