A semiconductor device is detachably mountable on a measurement target that includes sensors provided on a predetermined surface thereof. The semiconductor device includes a wiring board having a first surface, and a second surface opposite to the first surface, a semiconductor integrated circuit mounted on the first surface of the wiring board, measuring spring terminals mounted on the second surface of the wiring board, and projections provided on the second surface of the wiring board. Each of the measuring spring terminals makes contact with a terminal connecting to a corresponding one of the sensors to electrically connect the terminal and the corresponding one of the sensors, and each of the projections makes contact with the measurement target, in a state where the semiconductor device is mounted on the measurement target so that the predetermined surface of the measurement target opposes the second surface of the wiring board.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically connected to a conductive member are connected, and that can be easily produced, and a method for manufacturing the same. A circuit assembly includes a substrate provided with openings and an electronic component mounted on one side of the substrate, a conductive member that is a plate-shaped member fixed to another side of the substrate, the conductive member constituting a conductive path, and a relay member that is fixed to a surface on the substrate side of the conductive member and made of an electrically conductive material, the relay member being accommodated in the openings formed in the substrate, at least one terminal of the electronic component being connected to the relay member.

An electrical contact, a 3D LED and a method of manufacturing 3D LEDs are described. The electrical contact includes a printed circuit board (PCB) bridge and a PCB connector. The PCB bridge comprises at least one electrical contact. The at least one electrical contact is configured for electrical coupling with at least one interposer of a string of LEDs. The PCB connector is electrically coupled to the PCB bridge. The PCB connector comprises an electrical contact configured for electrical coupling with at least one external electrical wire.

An electronic device is provided. The electronic device includes a foldable housing including, a hinge structure, a first housing structure including a first surface, a second surface, and a first side member, wherein the first side member encloses at least a portion of a space between the first surface and the second surface and includes a first conductive portion, a first non-conductive portion, and a second conductive portion, and a second housing structure including a third surface, a fourth surface, and a second side member, a printed circuit board, at least one wireless communication circuit including a first electrical path and a second electrical path, a first variable element including a first terminal, a second terminal, and a third terminal, and a second variable element including a fourth terminal, a fifth terminal, and a sixth terminal.

The invention is related to an electrical circuitry assembly as well as a method for manufacturing such an electrical circuitry assembly, wherein the assembly basically but not exclusively comprising of an electrically conductive metal plate and a circuit including a conductive layer and wherein both the metal plate and the circuit shall be electrically connected to each other.

An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

An electronic device may include: a printed circuit board (PCB); a plurality of electronic components electrically connected to the PCB; and a connection member comprising a first portion fixed to one of the PCB and an electronic component and a second portion magnetically connected to the other one of the PCB and the electronic component. The second portion of the connection member may be moveably connected to the first portion. The connection member may further include a stopper, and may be designed to minimize the repulsive force provided by the connection member when excessive pressure is applied to the electronic device.

A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.

A cable connection structure includes: a substrate that includes: an opening; and a core wire connection electrode that is arranged on one of a principle surface and an inner layer across the opening; a cable that is arranged on a principle surface side of the substrate and includes a core wire that is electrically connected to the core wire connection electrode, the core wire connection electrode being extended so as to be separated from the substrate, the core wire connection electrode being connected to the core wire.