A through connector device is disclosed. The device may include a coaxial cable receiver portion defined by one or more surfaces, the coaxial cable receiver portion configured to couple to a center conductor portion of a coaxial cable, the center conductor portion of the coaxial cable protruding above a dielectric material of the coaxial cable. The device may include a beam lead positioned adjacent to the coaxial cable receiver portion. The device may include a planar transmission line contact pad configured to make electrical contact with a planar transmission line of a printed circuit board. The device may include a step configured to electrically and mechanically couple the beam lead to the planar transmission line contact pad, the step configured to create a gap between a bottom surface of the beam lead and a top surface of an outer conductor portion of the coaxial cable.

A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, at least one second build-up circuit layer, at least one conductive through hole, and a fine redistribution layer (RDL). The embedded block is fixed in a through cavity of the dielectric substrate. The electronic component is disposed in an opening of the embedded block. The first build-up circuit layer is disposed on a top surface of the dielectric substrate and electrically connected with the electronic component. The second build-up circuit layer is disposed on a bottom surface of the dielectric substrate and covers the embedded block. The conductive through hole is disposed in a via of the embedded block and electrically connects the first and the second build-up circuit layers. The fine RDL is disposed on and electrically connected to the first build-up circuit layer.

Provided is a matable electrical connection structure including a female connection member and a male connection member respectively including a plurality of first connection portions and a plurality of second connection portions, and a plurality of matable connection portions configured to detachably couple the female connection member and the male connection member, and respectively and electrically connect the plurality of first connection portions to the plurality of second connection portions, and the matable connection portions include inner conductive materials respectively and electrically connected to the plurality of first connection portions and provided on inner walls of a plurality of insertion holes formed in the female connection member, columns respectively and electrically connected to the plurality of second connection portions and configured to protrude from the male connection member to be inserted into the insertion hole, and elastic fins configured to extend outside the column to elastically contact the inner conductive material, and at least one of the female connection member and the male connection member is divided into a plurality of areas, and the plurality of matable connection portions are disposed to form a group in each of the areas.

A printed circuit board including a dielectric insulation layer having a top side facing a first side and a bottom side opposite the first side that faces a second side of the dielectric insulation layer, at least one conducting track formed on the dielectric insulation layer, and one or more conductor rails, wherein each of the one or more conductor rails is mechanically coupled to the dielectric insulation layer, and a first portion of each of the one or more conductor rails is arranged on the first side and a second portion of each of the one or more conductor rails is arranged on the second side of the dielectric insulation layer.

An electronic device is provided. The electronic device includes a foldable housing including, a hinge structure, a first housing structure including a first surface, a second surface, and a first side member, wherein the first side member encloses at least a portion of a space between the first surface and the second surface and includes a first conductive portion, a first non-conductive portion, and a second conductive portion, and a second housing structure including a third surface, a fourth surface, and a second side member, a printed circuit board, at least one wireless communication circuit including a first electrical path and a second electrical path, a first variable element including a first terminal, a second terminal, and a third terminal, and a second variable element including a fourth terminal, a fifth terminal, and a sixth terminal.

A system of circuit card components each include through-holes for soldering having recessed copper layers for thermal insulation. Thermal insulation prevents heat conduction away from flowing solder, allowing the solder to flow freely through the through-hole. Even high-temperature, lead-free solders may maintain the necessary temperature to flow. Different circuit layers include specialized features based on distance from a top or bottom surface. Vias surrounding the through-hole maintain the necessary cross-sectional area for electrical connectivity.

According to an embodiment, an electronic device is provided. the electronic device may comprise: a housing including a conductive portion and a non-conductive portion; a first substrate; at least one electronic component disposed on the first substrate; a second substrate electrically coupled to the first substrate, the second substrate including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; at least one contact member disposed between the first surface of the second substrate and the conductive portion of the housing; and a support member disposed between the first surface of the second substrate and the non-conductive portion of the housing.

A high frequency filter includes: a multilayer substrate including a first substrate for which lands are provided, a second substrate for which lands are provided, and a third substrate for which lands are provided, the third substrate being sandwiched between the first substrate and the second substrate; a columnar conductor electrically connected to the lands in the multilayer substrate; and columnar conductors provided to surround the columnar conductor, electrically connected to a ground plane of the first substrate, and electrically connected to a ground plane of the second substrate. The spacing between the lands of the first substrate and the lands of the third substrate and the spacing between the lands of the second substrate and the lands of the third substrate are electrical lengths of 90 degrees or less at the cutoff frequency.

A soldering component and a method of fitting it to boards are introduced. The soldering component includes a body and a fitting portion. The fitting portion is fitted to an object. The body has an engaging portion with an elastic retraction space conducive to elastic retraction of two or more engagement portions, allowing the engagement portions to engage with another object. The soldering component has a weldable surface to be soldered to a weldable surface of the object. The weldable surface of the object has a built-in solder layer adapted to be heated for soldering the soldering component and the weldable surface of the object together. The soldering component is disposed in a carrier, taken out with a tool, compared with the object by a comparison device to determine a fitting position on the object, positioned at the fitting position with the tool, thereby being fitted to the object.

A floating electrical connector includes a housing with a tubular portion. An axis is defined in a center of the tubular portion. Several floating terminals are arranged around the axis and are partially connected. Each floating terminal has an inner terminal sheet on an inner side and a spring structure on an outer side. Each spring structure is connected to one of the inner terminal sheets. A portion of the inner terminal sheet is inserted into the tubular portion and arranged along an inner peripheral surface of the tubular portion. The portion of each inner terminal sheet located in the tubular portion has an electronic contact bulging inward. Several external pins are electrically connected around the floating terminals. When a conductive pin is inserted into the tubular portion, the spring structures could elastically deform, allowing the tubular portion to adapt to a horizontal deviation or a skew deviation of the conductive pin, providing a greater tolerance for alignment deviations.