A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.

A power electronic assembly with a sleeve that has a virtual longitudinal axis and a circuit carrier. The sleeve has a tube-shaped plug-in section which runs around the longitudinal axis, and a first base section arranged at a first end of the plug-in section and runs around the longitudinal axis and extends away from the longitudinal axis. The first base section has at its end a flat first contact surface which runs around the longitudinal axis in a closed manner and which runs in a first plane which runs perpendicular to the longitudinal axis. The first base section has an edge surface which runs around the longitudinal axis in a closed manner and the first base section has a second contact surface which runs from the first contact surface and away from the first plane in the direction towards the edge surface.

A solution is provided that can be used in a communication node. A case is provided that supports a card module. The card module includes a circuit board with a front edge and a rear edge and includes a chiclet mounted adjacent the front edge. A housing can be pressed onto the circuit board and chiclet and be retain the housing in place. A transformer box is provided is provided on the circuit board between the housing and the rear edge. A POE card can be mounted on the circuit board between the transformer box and the housing.

A method can include coupling a semiconductor chip and an electrode with a substrate. Bottom and top mold die can be use, where the top mold die define a first space and a second space that is separated from the first space. The method can include injecting encapsulation material to form an encapsulation member coupled to and covering at least a portion of the substrate. The encapsulation member can include a housing unit housing the electrode. The electrode can have a conductive sidewall exposed to, and not in contact with the encapsulation member, such that there is open space between the conductive sidewall of the electrode and the encapsulation member from an uppermost surface to a bottommost surface of the encapsulation member, the substrate can having a portion exposed within the open space, and the encapsulation member can have an open cross-section perpendicular to an upper surface of the substrate.

A substrate includes electrically-conductive tracks. A semiconductor chip is arranged on the substrate and electrically coupled to selected ones of the electrically-conductive tracks. Containment structures are provided at selected locations on the electrically-conductive tracks, where the containment structures have respective perimeter walls defining respective cavities. Each cavity is configured to accommodate a base portion of a pin holder. These pin holders are soldered to the electrically-conductive tracks within the cavities defined by the containment structures. Each containment structure may be formed by a ring of resist material configured to receive solder and maintain the pin holders in a desired alignment position.

A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.

The disclosure provides a server including a housing, a plurality of hash boards, a power module and an electrical connection board. Each hash board is slidably arranged in a first accommodating space. The plurality of hash boards and the power module are respectively connected to the electrical connection board. The power module supplies power to the plurality of hash boards through the electrical connection board. The electrical connection board includes two conductive connection boards, each of which is provided with a plurality of conductive pins. The pins form multiple pairs of conductive pins in one-to-one correspondence. Each pair of conductive pins corresponds to each hash board and is electrically connected to supply power to the hash board. Each pair of conductive pins is detachably matched with each hash board to connect or disconnect the power supply path of the hash board.

A power electronic assembly with a sleeve that has a virtual longitudinal axis and a circuit carrier. The sleeve has a tube-shaped plug-in section which runs around the longitudinal axis, and a first base section arranged at a first end of the plug-in section and runs around the longitudinal axis and extends away from the longitudinal axis. The first base section has at its end a flat first contact surface which runs around the longitudinal axis in a closed manner and which runs in a first plane which runs perpendicular to the longitudinal axis. The first base section has an edge surface which runs around the longitudinal axis in a closed manner and the first base section has a second contact surface which runs from the first contact surface and away from the first plane in the direction towards the edge surface.

A fastening system comprises two interconnecting components for fastening electronic components which can be joined by snap-fit when a fastener component is pressed against a retainer. The fastening system consists of a fastener stud with a planar base at the bottom and an upwardly extending shank with a neck portion of reduced diameter adjacent the base. The stud has a spherical ball portion with a flat planar top surface at a distal top end. The fastener stud mates with a retainer having a planar base and affixed opposing resilient arms extending orthogonally from the base centered about a rotational axis. The arms preferably have compound shaped inner surfaces symmetrical about the axis. These surfaces comprise a cylindrical portion adjacent the base and a spherical portion adjacent the distal ends of the arms.

Disclosed is a novel timer module. The novel timer module includes a replaceable movement, a master control circuit board, an upper housing, and a lower housing. A circuit board is disposed inside the replaceable movement. Five first inserting pins are welded on the circuit board. The first inserting pins are exposed from the outside of a housing of the replaceable movement. The master control circuit board is located in the upper housing and the lower housing, and is fixed on an upper surface of the lower housing. A relay is disposed inside the master control circuit board. Contacts of the relay respectively extend and are fixed on a surface of the master control circuit board by using leads. Therefore, a problem that a conventional timer movement is fixedly welded on a circuit of a timer module can be resolved.