A power supply assembly includes a power supply unit disposed within a housing and an adjustable plate module movably disposed on a floor thereof. The adjustable plate module includes a plate, a shaft, a stopper panel, and a compressible device. The plate has two planar surfaces positioned at different heights with respect to the floor. The shaft is fixedly coupled to and extends outwardly from the plate. The shaft is configured to move between a first position and a second position to transition a connector between the planar surfaces. The stopper panel is disposed adjacent to a distal end of the shaft and has an opening therein for accommodating the shaft. The compressible device is disposed around the shaft such that a displacement of the plate causes the compressible device to compress against the stopper panel and facilitate movement of the shaft from the first position to the second position.

A positioning fixture including a shielding member and a driving member is provided. The shielding member includes a sliding part slidably connected to a functional module, a guiding part, and a shielding part. The sliding part and the shielding part respectively extend from two opposite ends of the guiding part. The driving member is movably disposed on the functional module corresponding to the shielding member. The driving member includes a base part, a driving part that contacts the guiding part, and a pillar part, which protrudes from the base part and is adapted to pass through the guiding groove. When the functional module is positioned on the circuit board, the base part of the driving member is pushed by the electronic component, and the guiding part is pushed by the driving part, so that the shielding member slides and the shielding part shields a screw hole of the circuit board.

A printed circuit board (PCB) system includes a first printed circuit board (PCB), an integrated circuit (IC) package, and a memory module. The IC package includes i) a package substrate, ii) a main IC chip that is electrically coupled to a top surface of the package substrate, iii) first contact structures that are disposed on a bottom surface of the package substrate and that are electrically coupled to the first PCB, and iv) second contact structures that are disposed on a top surface of the package substrate. The memory module includes i) a second PCB, ii) one or more memory IC chips that are disposed on the second PCB, and iii) third contact structures that are disposed on a bottom surface of the second PCB. An interposer electrically couples the second contact structures of the IC package with the third contact structures of the memory module.

A stiffener device is suitable for use with an assembly that includes an electronic mother board, an electronic daughter board, a connector for connecting the daughter board parallel to the mother board, and an element for holding in position the daughter board in relation to the mother board. The stiffener device has a main clamp configured to hold tightly the upper surface and the lateral vertical surfaces of the connector.

A printed circuit board comprises N power switching cells operating in parallel and respectively comprising a transistor leg, at least one decoupling capacitor and a gate driver circuit. Each transistor leg comprises respective first and second transistors in series, a drain of the first transistor being connected to a positive DC line, a source of the second transistor being connected to a negative DC line, a source of the first transistor being connected to a drain of the second through a connection middle-point connected to an output terminal. Each gate driver circuit controls respective switching ON and OFF of the corresponding first and second transistors. The N transistor legs of the corresponding N power switching cells are positioned to substantially form a convex polygon having N edges of substantially the same length, each one of the N transistor legs being positioned along one of the edges of the convex polygon.

The present disclosure generally relates to a computer circuit board having an integrated voltage regulator assembly that may include a heat sink and at least one voltage regulator module board. The heat sink may have a metal plate with at least one recess in which the voltage regulator module board may be attached. The voltage regulator module board is electrically coupled to a semiconductor package and the heat sink is thermally coupled to the semiconductor package. The computer circuit board is used in high-performance computing devices including computer workstations and computer servers.

In an electrical device, a model series of electrical devices, and a production method, in particular for a converter, having a circuit board including circuit traces, the circuit board has two similar and/or identical contact area arrays, the contact area arrays in particular transitioning into each other through rotation and/or displacement. A first contact area array of the contact area arrays is fitted with a first power module, and the second contact area array is able to be fitted with a second power module, e.g., so that a respective electric motor is able to be supplied from the respective power module.

The present invention relates to a manufacturing method of a metal PCB assembly for a vehicle lamp and the metal PCB assembly made by the method. The manufacturing method of a metal PCB assembly for a vehicle lamp comprises a step S100 in which a material of a metal PCB 14 is prepared, a step S110 in which a circuit pattern 22 and a plurality of unit patterns 16 are formed and cut from the material of a metal PCB 14 to form a metal PCB 14, a step S120 in which a bending groove 24 is formed on a bottom surface of the metal PCB 14, a step S130 in which each of the unit patterns 16 is protruded forward around the bending groove 24 of the metal PCB 14 such that each of the unit patterns 16 is bent to be inclined from the metal PCB 14, and a step S140 in which a stepwise injection molded products 12 is coupled with the metal PCB 14 while the unit pattern 16 is protruded.

The power conversion device includes: a main circuit having first and second wiring layers formed respectively on both surfaces of a base board, mounted parts mounted on the first and second wiring layers, and first and second GND layers formed respectively, between external- and internal-layer portions of the base board and in regions corresponding to the mounted parts each being a mounted part which forms a circuit other than a circuit having an inductance component as a lumped constant, and to the first and second wiring layers; and a cooler attached to the base board by means of fixing screws through a first through-hole created in an end portion of the board; wherein the first and second GND layers are each formed so that creepage distance is created around a second through-hole in which a lead insertion part that mutually connects the first and second wiring layers is inserted.

An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.