An automated and/or motorized spatial frame including a control unit and a plurality of motorized struts is disclosed. The control unit being configured as a controller for exchanging data with an external computing system, exchanging data with the plurality of motorized struts, and delivering power to the motorized struts. Thus arranged, the control unit may be configured as a fully integrated power supply and controller for powering and controlling the motorized struts. In some embodiments, the control unit includes a plurality of PCB modules, each positioned within the spaces or pockets formed between adjacent tabs on a ring of the frame. The PCB modules being detachably coupled to the ring. In some embodiments, the PCB modules may be detachably coupled to the ring via interconnecting male and female connectors. Alternatively, the PCB modules may be detachably coupled to the ring via a plurality of brackets.

An electronic device includes a top plate having a first surface and a second surface that is positioned at an elevation that is lower than an elevation of the first surface, the second surface extending from a first end part of the top plate to a second end part of the top plate, a bottom plate provided under the top plate, and a circuit board placed between the top plate and the bottom plate and mounted with an electronic component. The top plate has opposing first and second edges and opposing third and fourth edges that are perpendicular to the first and the second edges, the first end part being formed at the first edge and the second end part being formed at the second edge.

Examples of card fasteners and assemblies for fastening cards to printed circuit boards are discussed. A card fastener comprises a frame comprising a first arm, a second arm, and an intermediate portion joining the first arm and the second arm. A compressive pad is attached to the intermediate portion. The first arm and second arm are to couple to hooks on a printed circuit board of a device and the compressive pad is to come in contact with the card.

An electronic device is provided. The electronic device includes a first substrate on which a first electrical element and a first conductive structure, which is configured to surround the first electrical element, are disposed, a second substrate on which a second electrical element and a second conductive structure, which is separably connected to the first conductive structure, are disposed, and a connector which is disposed between the first substrate and the second substrate and electrically connects the first electrical element to the second electrical element.

A power semiconductor module includes: an electrically insulative frame having opposite first and second mounting sides, and a border that defines a periphery of the electrically insulative frame; a first substrate seated in the electrically insulative frame; a plurality of power semiconductor dies attached to the first substrate; a plurality of signal pins attached to the first substrate and electrically connected to the power semiconductor dies; a plurality of busbars attached to the first substrate and extending through the border of the electrically insulative frame; a plurality of fixing positions at the first mounting side of the electrically insulative frame; and a plurality of electrically insulative protrusions jutting out from the second mounting side of the electrically insulative frame, wherein the protrusions are vertically aligned with the fixing positions. Methods of producing the power semiconductor module and power electronic assemblies that incorporate the power semiconductor module are also described.

A display apparatus and an antenna assembly are provided. The display apparatus includes: a display; a first circuit board including at least one electronic part configured to process an image signal for displaying an image on the display; a second circuit board including at least one antenna configured to transmit and receive a radio frequency (RF) signal for communication between the display apparatus and an external apparatus; and a spacer provided between the first circuit board and the second circuit board, and configured to space the first circuit board and the second circuit board apart from each other. Thus, radiation performance in the antenna is improved with easy design based on the structure of the display apparatus. Thus, radiation performance in the antenna is improved with easy design based on the structure of the display apparatus.

This application discloses a board, an electronic device, and a manufacturing method, and pertains to the field of bare die package technologies. The board includes a PCB assembly, a bare die, a reinforcing frame, a heat sink, and fasteners. Both the bare die and the reinforcing frame are located on a surface of the PCB assembly, the bare die is located in the reinforcing frame, and the reinforcing frame is fixedly connected to the PCB assembly by using the fastener. The heat sink is located on a surface of the bare die that is away from the PCB assembly, and the heat sink is fixedly connected to the reinforcing frame by using the fastener.

An example includes: a system board having a surface; bond fingers on a surface of the system board; a semiconductor device on the surface of the system board, the semiconductor device comprising a semiconductor die having a surface, the semiconductor die comprising bond pads on the surface; conductors coupling the bond pads to the bond fingers; and a datum structure on the surface of the system board, the datum structure having openings that form wells with sides around the bond fingers.

The present invention is directed to a wire comb. The wire comb includes a flat body which includes a first end and a second end. The ends are connected by an arcuate section which has an upper and lower surface. The upper surface of the arcuate section has a wire mount area that includes at least one opening formed in the upper surface with each opening including a shape selected to receive and hold a wire within. A mounting feature extends from at least one of the first end and the second end. The mounting feature is adapted to engage a printed circuit board.

An electric compressor includes: a circuit board on which a plurality of switching elements (33) are mounted; a compression mechanism which is driven by a motor operated using AC power output from the switching elements (33); and a lead holding member (50) disposed between element main bodies (33a) of the switching elements (33) and the circuit board. The circuit board includes a plurality of through-holes through which a plurality of leads (33b) that extend from the element main bodies (33a) can be respectively inserted. The lead holding member (50) includes lead insertion holes (53) through which the leads (33b) can be inserted such that positions of the leads (33b) is held at positions that correspond to positions of the through-holes.