A vibration isolator and method of assembly utilize “flex circuits” to provide both vibration/shock isolation and integrated electrically isolated conductive paths to support lightweight devices (<100 grams) such as crystal oscillators, IC chips, MEMs devices and the like. Each flex circuit includes a least one polymer layer and at least one of the flex circuits includes at least one patterned conductive layer. The isolator may be integrally formed from a stack of polymer layers and patterned conductive layers to provide the plurality of flex circuits, platform and connectors. Most typically, flex circuits are Type 4 in which the multiple polymer layers have a loose leaf or bonded configuration. Flex circuits are easy to produce in large quantities at low cost with standardized and repeatable performance characteristics.

The present disclosure relates to an attaching apparatus (2) and an attaching method. The attaching apparatus (2) includes: an auxiliary attaching structure having a protective film layer (20) and a support part (21), and the protective film layer (20) includes first areas (20a) and second areas (20b), each first area (20a) is configured to correspond to an installation area (10a), first sides of the first areas (20a) can be attached to body parts (13a) of rigid structural members on the installation areas (10a) corresponding to the first areas (20a) and receiving through holes (20c) or receiving recesses (20d) are formed at positions on the first areas (20a) corresponding to installation protrusions (13b), the second areas (20b) are configured to correspond to bending areas (10b); and a laminating jig (22) that can be located on a second side of the protective film layer (20).

Precisely aligned assemblies can be complex, time consuming, labor intensive, and expensive and a need exists for better alternatives. Systems and methods described herein yield high precision printed circuit board assemblies (PCBAs) that contain pre-built alignment features to address this need. The work of precisely locating components on the PCBA to a final position in the overall assembly is already built in to the board. Locating features are used to precisely position one or more components, such as optical components, electro optical components, or mechanical components in assemblies. The locating features may be used to constrain the positions of those components, such as by kinematic coupling, solder wetting dynamics, semiconductor cleaving, dicing, photolithographic techniques for etching, constant contact force, and advanced adhesive technology to result in optical level positioning that significantly improves or eliminates assembly alignment challenges.

A module includes a protective shield with a three-dimensional (3D) pattern to increase a rate of heat dissipation. As circuit components get smaller in size, more circuit components can fit into a module, thereby increasing heat density in the module. Some of the heat in a module is conducted through an overmold disposed on the circuit components. The heat conducted through the overmold then dissipates through an optional protective shield on an exterior surface of the overmold. A rate of heat dissipation depends on the surface area of the overmold and, if any, the protective shield. In an exemplary aspect, a 3D pattern is formed in the exterior surface of the overmold to increase the surface area to increase a rate of heat dissipation from the module. Improved heat dissipation improves performance and product life of the circuit components in the module.

A power conversion device comprises: a power conversion circuit that converts a supplied electric power; a current detection circuit that detects a current; a control circuit that controls an operation of the power conversion circuit; and a multilayer substrate that is provided with the power conversion circuit, the current detection circuit, and the control circuit. The multilayer substrate includes a printed wiring, and the printed wiring includes a transmission pattern that transmits a detection signal detected by the current detection circuit to the control circuit. An on-off fluctuation unit of the power conversion circuit fluctuates. The whole of the transmission pattern is disposed at a position different from the on-off fluctuation unit in a direction perpendicular to a plate surface of the multilayer substrate.

Disclosed is a wiring board, including: a base body having insulating properties; and a wiring conductor positioned on the base body. The base body has a first surface, a fourth surface positioned opposite to the first surface, and a second surface and a third surface positioned at side surfaces between the first surface and the fourth surface. The first surface, the second surface, and the third surface are mounting surfaces for respective electronic components, and the fourth surface is an installation surface.

The present application has an object of restricting a temperature rise caused by heat generated by an electronic part or a connection member mounted on a substrate, and includes a first heat conducting member that thermally couples the bus bar extended to a housing side and the housing, a second heat conducting member that thermally couples a capacitor and the housing, and a third heat conducting member that thermally couples a semiconductor element and the housing, wherein each of the bus bar, the substrate, the capacitor, and the semiconductor element is cooled.

An integrated heat exchanger has a heat exchanger within a circuit board. The circuit board can be a PCB having one or more electronic components coupled to its top-side surface. The conductive layers of the PCB include a first sub-set of electrically conductive interconnects and as second sub-set of electrically conductive interconnects. The first sub-set of conductive layers are electrically connected to each other and to the one or more electronic components. The second sub-set of conductive layers are electrically isolated from the first sub-set of conductive layers by intervening non-conductive layers such as prepreg. In this manner, the heat exchanger is electrically isolated from the one or more electronic components. The second sub-set of conductive layers include a dedicated top-side conductive layer to which a baseplate can be attached. The baseplate is also attached to the one or more electronic components via an electrically non-conductive gap filler.

A semiconductor assembly includes a carrier including a dielectric substrate and a plurality of contact pads disposed on an upper surface of the carrier, first and second surface mount packages mounted on the carrier, first and second discrete inductors respectively mounted over the first and second surface mount packages, wherein the first and second surface mount packages each comprise lower surface terminals that face and electrically connect with the contact pads from the carrier, wherein the first and second surface mount packages each comprise an upper side that faces away from the carrier, and wherein the first and second discrete inductors are respectively thermally coupled to the upper sides of the first and second surface mount packages.

Disclosed herein is an electronic device and printed circuit board (PCB). The electronic device includes: a housing, the PCB disposed in the housing, a first shielding part including a first shielding member having a closed shape, disposed on a first surface of the PCB, a second shielding part including a second shielding member having a closed shape, a shielding cover covering the first shielding part and the second shielding part, wherein the first shielding member and the second shielding member contact each other at a first location and a second location on the first surface, wherein a third shielding part is defined between the first shielding member and the second shielding member, and wherein the shielding cover is disposed to correspond to the first shielding part, the second shielding part, and the third shielding part.