A device may include a frame, a first leg extending from the frame, and a second leg extending from the frame, wherein each of the first leg and the second leg is curved in a respective direction, the respective directions being different.

The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.

A press-fit mounting peg (2) is described for retaining a component such as a stepped-motor on a circuit board (21). The mounting peg (2) is securable in a mounted position by a first axial displacement of a locking pin (17) along a pin channel (16) of the press-fit mounting peg (2) in a first axial direction along a longitudinal axis of the press-fit mounting peg (2) from a first axial position to a second axial position. The pin channel (16) comprises at least one pin displacement stop (13, 20) for stopping a second axial displacement of the locking pin (17) out of the second axial position.

A lighting fixture, including a bus printed circuit board that receives power from an external source, may be configured with programmable drivers. The bus printed circuit board has mechanical features for receiving the programmable drivers to mechanically mount the programmable driver to the bus printed circuit board. Each programmable driver may have a set of spring contacts positioned to engage exposed pads of the bus printed circuit board when the programmable driver is mounted to the bus printed circuit board, to supply power to the programmable driver. The lighting fixture further includes one or more light sources driven by the programmable drivers.

The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members. The system additionally includes a sensor holder coupled to the PCBA. The image sensor package and the sensor holder are coupled to the PCBA so as to minimize thermally-induced stresses in at least one of: the plurality of bond members, the PCBA, the sensor holder, or the image sensor package.

An inductor includes a magnetic core, a first winding, a first electrically conductive standoff, and a second electrically conductive standoff. The magnetic core includes opposing first and second outer surfaces separated from each other in a first direction. The first winding has first and second ends, and the first winding is wound around at least a portion of the magnetic core. The first electrically conductive standoff is connected to the first end of the first winding, and the first electrically conductive standoff extends along the magnetic core in the first direction from the first outer surface to the second outer surface. The second electrically conductive standoff is connected to the second end of the first winding, and the second electrically conductive standoff extends along the magnetic core in the first direction from the first outer surface to the second outer surface.

A power electronics module having at least one electronic chip, and an electrically insulating overmolded block at least partially encapsulating each of the at least one chip. The module includes at least one projection against which a component can bear, such as an electronic circuit board for controlling each chip. The projection includes an electrically insulating material and extending from one face of the block.

A terminal, an input/output assembly and a bracket are provided. The bracket includes a body. The body includes a first face and a second face facing away from each other. The second face is provided with a plurality of accommodating chambers. The first face is provided with a plurality of through holes corresponding to the plurality of accommodating chambers. The plurality of accommodating chambers is configured to accommodate an input/output module fixedly mounted therein and to expose the input/output module from the second face. The plurality of through holes is configured to expose the input/output module from the first face.

An apparatus for mounting on a circuit board is provided. The apparatus may include a circuit board mount packaging and a battery. The circuit board mount packaging may include a cavity, a first internal lead, and a second internal lead. The first internal lead may be connect to a first external pin and the second internal lead may be connected to a second external pin. The battery may be disposed within the cavity of the circuit board mount packaging. The battery may comprise an anode and a cathode. The anode may be wire bond connected to the first internal lead and the cathode may be wire bond connected to the second internal lead.

A diversified assembly printed circuit board includes a first printed circuit board provided with a multiple first conductive metals protruding from a surface of the first printed circuit board, and a multiple second printed circuit boards each provided with a multiple second conductive metals protruding from a surface of the each of the second printed circuit boards. At a connection position, solidified conductive metal paste is arranged between each of the first conductive metals and a corresponding second conductive metal to electrically connect each of the first conductive metals and the corresponding second conductive metal. A laminated adhesive sheet is arranged between each of the second printed circuit boards and the first printed circuit board to physically connect the second printed circuit boards and the first printed circuit board.