A method of manufacturing a wiring board includes a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via substrates (insulating layers) provided among the wiring layers and a laminated plate is manufactured and a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.

An interposer for mechanically and electrically connecting two circuit boards is described. The interposer can be bent to enclose an area of a circuit board. The interposer can include a first layer external to the enclosed area. The first layer can be conductive and can serve as an EMI shield. The interposer can also include a second layer internal to the enclosed area. The second layer can be non-conductive but can carry multiple discrete pins that can electrically couple the first and second circuit boards and provide signal transmission pathways between the circuit boards. The interposer can be formed by folding a sheet of conductive material having different cutout regions that forms a comb pattern into multiple stacked layers. Then, the bent regions that connect the stacked layers can be removed so that the conductive bars in the comb patterns can be separated and isolated to form discrete pins.

An electrical connector, used for electrically connecting a chip module to a circuit board, includes: an insulating body, provided with multiple accommodating grooves penetrating through the insulating body; and multiple conductive terminals, correspondingly accommodated in the accommodating grooves. Each conductive terminal includes a first terminal and a second terminal independently provided. The first terminal has a first connecting portion and an elastic arm, and the elastic arm has a contact portion to be in contact with the chip module. The second terminal has a second connecting portion and a conducting portion to be electrically connected with the circuit board. At least one fixing groove is provided on at least one of the first connecting portion and the second connecting portion, and the first terminal and the second terminal are mated and fixed along a vertical direction by the at least one fixing groove.

A compliant pin system includes a pin having a compliant section including a first leg and an opposing second leg. A first plurality of contact members extend along the first leg. A second plurality of contact members extend along the second leg. A pin validation system is operatively connected to the first plurality of contact members and the second plurality of contact members. The pin validation system detects a presence of an electrical signal passing between corresponding pairs of the first plurality of contact members and the second plurality of contact members to determine an integrity of the compliant pin.

A soldering fastening element and a method for mounting the soldering fastening element are introduced. The soldering fastening element is soldered to a first circuit board so as for a second board to be coupled thereto. The soldering fastening element includes a body soldered to the first circuit board, a head for fastening the second board in place, and a neck which connects the body and the head. When in use, the soldering fastening element is contained in a carrier, taken out of the carrier with an automated tool, transferred to the first circuit board, and heated through a solder layer on the first circuit board such that the body gets soldered to the first circuit board to form a module member. Therefore, the second board gets coupled to the first circuit board through the head and neck.

A compliant pin system includes a pin having a compliant section including a first leg and an opposing second leg. A first plurality of contact members extend along the first leg. A second plurality of contact members extend along the second leg. A pin validation system is operatively connected to the first plurality of contact members and the second plurality of contact members. The pin validation system detects a presence of an electrical signal passing between corresponding pairs of the first plurality of contact members and the second plurality of contact members to determine an integrity of the compliant pin.

An electrical connector includes: an insulating body, provided with multiple accommodating holes; multiple terminals, respectively accommodated in the accommodating holes, where each of the terminals is provided with a clamping portion; and multiple solder posts, each being clamped by the clamping portion of one of the terminals. A height of each solder post is greater than a maximum width of each solder post. Each solder post is formed by a first base and a second base connected with each other. The clamping portion clamps the first base. The second base is located outside the clamping portion. A height of the first base and a height of the second base are both greater than one half of the maximum width of each solder post. The height of the second base is greater than 0.15 mm.

An electrical connector, used for electrically connecting a chip module to a circuit board, includes: an insulating body, provided with multiple accommodating grooves penetrating through the insulating body; and multiple conductive terminals, correspondingly accommodated in the accommodating grooves. Each conductive terminal includes a first terminal and a second terminal independently provided. The first terminal has a first connecting portion and an elastic arm, and the elastic arm has a contact portion to be in contact with the chip module. The second terminal has a second connecting portion and a conducting portion to be electrically connected with the circuit board. At least one fixing groove is provided on at least one of the first connecting portion and the second connecting portion, and the first terminal and the second terminal are mated and fixed along a vertical direction by the at least one fixing groove.

A method of manufacturing a wiring board includes a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via substrates (insulating layers) provided among the wiring layers and a laminated plate is manufactured and a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.

An electrical circuit arrangement has at least one capacitor (1) and at least one other circuit part (4) electrically cooperating with the first capacitor (1). The first capacitor (1) is part of a first capacitor arrangement (2) which annularly surrounds the cavity (3). The other circuit part (4) is provided at least partially within the cavity (3) and is electrically connected to the first capacitor (1). The first capacitor arrangement (2) has fastening elements (7) by means of which the circuit arrangement can be mechanically fastened to a holding element (8).