H05K2201/10795

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms.

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

In a general aspect, an electronic device assembly includes a substrate arranged in a plane. The substrate has a first side and a second side, the second side being opposite the first side. The assembly also includes a plurality of semiconductor die disposed on the first side of the substrate and at least one signal pin. The at least one signal pin includes a proximal end portion coupled with the first side of the substrate, a distal end portion, and a medial portion disposed between the proximal end portion and the distal end portion. The medial portion is pre-molded in a molding compound, the proximal end portion and the distal end portion exclude the molding compound. The at least one signal pin is arranged along a longitudinal axis that is orthogonal to the plane of the substrate.

SEMICONDUCTOR PACKAGE WITH GUIDE PIN

A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.

Methods of making printed structures

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

Methods of making printed structures

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

POWER DISTRIBUTOR OF AN ELECTRICAL SYSTEM OF A MOTOR VEHICLE

A power distributor of an electrical system of a motor vehicle, including a circuit board, which has a main connection to a main circuit and multiple secondary connections. Each secondary connection is assigned to one secondary circuit and electrically contacted with the main connection via a circuit breaker having two connections. The connections of each circuit breaker are electrically contacted directly with the circuit board. The invention also relates to a circuit breaker.

FPCB Assembly for Battery Module, Its Manufacturing Method, and Battery Module Including the Same
20210184379 · 2021-06-17 · ·

A flexible printed circuit board (FPCB) assembly for a battery module includes a insulated flexible film and conductor patterns arranged inside the film in a predetermined form, and the conductor patterns transmit an electric signal. The FPCB assembly includes a main FPCB configured to extend in one direction; and a sub FPCB assembled to at least one side of the main FPCB and configured to extend in a direction different from the main FPCB.

Systems and methods for providing a high speed interconnect system with reduced crosstalk

Systems and methods for providing a PWB. The methods comprise: forming a Core Substrate (CS) a First Via (FV) formed therethrough; disposing a First Trace (FT) on an exposed surface of CS that is in electrical contact with FV; laminating a first HDI substrate to CS such that FT electrically connects FV via with a Second Via (SV) formed through the first HDI substrate; disposing a Second Trace (ST) on an exposed surface of the first HDI substrate that is in electrical contact with SV; and laminating a second HDI substrate to the first HDI substrate such that ST electrically connects SV to a Third Via (TV) formed through the second HDI substrate. SV comprises a buried via with a central axis spatially offset from central axis of FV and SV. FV and SV have diameters which are smaller than TV's diameter.

Press-fit terminal, connector for board, and board-equipped connector

An object is to, for physical properties, holding force, contact area, and insertion force in a trade-off relationship, set the holding force to 37 N or more, the contact area to 0.72 mm2 or more, and the insertion force to 90 N or less. A press-fit terminal is to be press-fitted into a through hole formed in a circuit board. A press-fit part includes a beam and an eye hole that is surrounded by the beam. The beam includes two parallel parts that are parallel to each other. In the press-fit part, G1/G2 is 0.20 or more and 1.05 or less where a front-side spring strength is G1 [mm3] and a rear-side spring strength is G2 [mm3] calculated under the following conditions, and G is 0.007 mm3 or more and 0.012 mm3 or less where a spring strength G [mm3] is G1+G2.