A mounted structure of a supporting-terminal-equipped capacitor chip includes first and second supporting terminals. The first supporting terminal includes a first helical electrically conductive portion extending in a first axial direction along a main surface. The second supporting terminal includes a second helical electrically conductive portion extending in a second axial direction along the main surface. The first helical electrically conductive portion is electrically connected to a first outer electrode at an outer peripheral side surface of the first helical electrically conductive portion. The second helical electrically conductive portion is electrically connected to a second outer electrode at an outer peripheral side surface of the second helical electrically conductive portion.

In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.

In one example in accordance with the present disclosure, a fluid ejection controller is described. The fluid ejection controller includes a firing board to pass control signals to a fluid ejection device to eject fluid from the fluid ejection device. A mount pivotally holds the firing board between a disengaged position where electrical pins of the firing board are not in contact with electrical pads of the fluid ejection device and an engaged position where the electrical pins are in contact with the electrical pads. The mount includes a slot to receive the fluid ejection device and at least one biasing spring to bias the firing board away from the fluid ejection device during insertion of the fluid ejection device. The fluid ejection controller also includes a handle coupled to a cam shaft to move the firing board between the disengaged position and the engaged position.

A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

An electric component includes: a semiconductor component including a heat radiating portion, a semiconductor element, a lead terminal, and a coating resin coating a part of each of the above; a wiring board including a first mounting portion, a second mounting portion, and an insulating substrate; a first solder connecting the first mounting portion and the heat radiating portion; and a second solder connecting the second mounting portion and the lead terminal. The first solder includes (a) a solder connecting portion connecting the heat radiating portion and the first mounting portion and (b) a flux provided around the solder connecting portion, and a third space which is provided as a space after excluding a second space that is an overlap of the heat radiating portion and the first mounting portion from a first space.

In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.

A mounted structure of a supporting-terminal-equipped capacitor chip includes first and second supporting terminals. The first supporting terminal includes a first helical electrically conductive portion extending in a first axial direction along a main surface. The second supporting terminal includes a second helical electrically conductive portion extending in a second axial direction along the main surface. The first helical electrically conductive portion is electrically connected to a first outer electrode at an outer peripheral side surface of the first helical electrically conductive portion. The second helical electrically conductive portion is electrically connected to a second outer electrode at an outer peripheral side surface of the second helical electrically conductive portion.

Systems and methods for fine pitch component placement on printed circuit boards are described. In one embodiment, a printed circuit board includes multiple vias and multiple of electrically conductive pads. The multiple vias include at least a first via and a second via. The multiple electrically conductive pads include a first pad and a second pad. The first pad and/or the second pad may include an electrically conductive material such as copper, silver, gold, or another conductive material. In some cases, the first pad and the second pad each have a reduced width portion positioned between and spaced apart from the first via and the second via.

A printed wiring board includes a multilayer body, a first wiring layer formed on first surface of the body and including first pads, a second wiring layer embedded into second surface of the body and including second and third pads, conductor posts formed on the third pads, and via conductors formed in the body and having diameter reducing toward the second surface of the body. Each third pad has metal foil formed thereon such that each post is formed on the foil, the second wiring layer is formed such that the second pads are positioned to connect an electronic component in central portion of the second surface of the body and the third pads are positioned to connect another board in outer edge portion of the second surface of the body, and the second pads are formed such that each second pad has exposed surface recessed from the second surface.

Illustrative embodiments disclosed herein pertain to a capacitive coupler that is custom fabricated to provide shape conformability with a component under test. The shape conformability allows the capacitive coupler to provide a high level of capacitive coupling between an electrode in the capacitive coupler and a metal part contained in the component. The electrode in the capacitive coupler has one or more characteristics such as a shape and an orientation, that are defined by utilizing the metal part as a template during fabrication of the capacitive coupler. In one exemplary embodiment, the electrode in the capacitive coupler has a form factor that substantially matches a form factor of the metal part contained in the component. In another exemplary embodiment, the metal part is oriented at a non-orthogonal angle with respect to a major surface of a printed circuit board upon which the component is mounted.