The present disclosure relates to a display apparatus. The display apparatus may include a display panel, a peripheral region, an electronic component, and a gap-fill layer. The display panel defines a display region. The peripheral region is adjacent to the display region. The peripheral region includes lines and pads. The lines are disposed in the peripheral region, and the pads are connected to the lines. The electronic component includes connecting pads in contact with the pads. The gap-fill layer is between the display panel and the electronic component, between the connection pads, between the pads, and in the openings. Each of the pads may overlap at least two pads of the connection pads, and the openings may overlap between the connection pads, when viewed in a plan view.

An electronic device module includes: a substrate; a sealing portion disposed on the substrate; at least one electronic device mounted on the substrate and embedded in the sealing portion; and a roof wiring at least partially disposed on a surface of the sealing portion and electrically connecting the substrate to the at least one electronic device or electrically connecting electronic devices, among the at least one electronic device, to each other. The roof wiring includes: a surface wiring disposed on one surface of the sealing portion; and at least one post wiring connecting the surface wiring to the substrate or to the at least one electronic device, and wherein at least a portion of a circumferential surface of the at least one post wiring is bonded to the surface wiring.

A power module for the controllable electrical power supply of a consumer includes a plurality of housed power semiconductors each with an electrically non-insulated heat discharge surface, a printed circuit board, a heat sink, one or more insulation plates, wherein the printed circuit board is arranged on a side of the power semiconductor in an orthogonal direction opposite the heat sink, wherein the insulation plate is arranged between the housed power semiconductors and a cooling surface of the heat sink, wherein one insulation plate in each case is interlockingly connected by one side to one electrically non-insulated heat discharge surface of a housed power semiconductor and is interlockingly connected by the other side to the heat sink.

An electronic device carrier structure can include a substrate including a plurality of electrical contacts spaced apart on the substrate, a plurality of electrically conductive balls, each of the electrically conductive balls being on a respective one of the plurality of electrical contacts, solder attaching each of the electrically conductive balls to respective ones of the electrical contacts to form an attachment boundary where the solder ends on a surface of each of the plurality of electrically conductive balls, and a polymer layer extending on the substrate onto the plurality of electrically conductive balls to form a surface of the polymer layer at a contact point on the plurality of electrically conductive balls that is above the attachment boundary and below an apex of each of the plurality of electrically conductive balls.

A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.

A capacitive fingerprint identification apparatus, a preparation method and an electronic device can improve the performance of a capacitive fingerprint apparatus and the users' using experience. The capacitive fingerprint identification apparatus is configured to be provided on an arc-shaped surface of the electronic device, including: a capacitive fingerprint identification package structure; an arc surface structure, including a first surface and a second surface, where the first surface of the arc surface structure is a plane, the second surface of the arc surface structure is an arc surface. Setting the arc surface structure on the capacitive fingerprint identification apparatus can not only make itself and the electronic device where it is located more aesthetical in appearance and have a more three-dimensional sense, but also protect the electronic device when the electronic device is dropped, so the influence on the capacitive fingerprint identification apparatus is small.

An example includes: a system board having a surface; bond fingers on a surface of the system board; a semiconductor device on the surface of the system board, the semiconductor device comprising a semiconductor die having a surface, the semiconductor die comprising bond pads on the surface; conductors coupling the bond pads to the bond fingers; and a datum structure on the surface of the system board, the datum structure having openings that form wells with sides around the bond fingers.

A fluidic connection and fluid heating device for a fluid circuit, in particular for a motor vehicle, the device comprising a one-piece tubular body of plastic or composite material comprising at least one internal annular surface defining a fluid flow duct from an inlet to an outlet of the body and at least one external annular surface extending around the duct and on which is located at least one resistive heating element, wherein the resistive heating element is a resistive circuit which is formed in situ on the annular surface.

A printed circuit board connecting device (1) for connecting printed circuit boards (3, 5) includes a non-conductive plate (21) having a top side and a bottom side, and a plurality of interface connections (23) which are arranged in the plate (21) so as to be spaced apart from one another. Each interface connection (23) has grouped-together conductors (41) which extend through the plate (21) and which are laterally enclosed by the plate material and the end regions of which protruding on the top side and lower side from the plate (21) can be fixed to interfaces (13) of two printed circuit boards (3, 5) to be connected. Therefore, the conductors (41) form both a mechanical and an electrical connection between the interfaces (13) of the printed circuit boards (3, 5).