According to one embodiment, a semiconductor storage device includes a housing, a first board, a heat generating component, an electronic component, and a thermal-conductive sheet. The housing has a first vent hole. The first board is accommodated in the housing. The heat generating component is mounted on the first board. The electronic component is disposed between the heat generating component and the first vent hole. The thermal-conductive sheet is provided to extend over the heat generating component and the electronic component, or provided to extend from a region positioned on a rear side of the heat generating component on the first board to the electronic component.

A heat sink includes a heat sink fin (HSF), a first heat sink plate (HSP), and a second HSP that is opposite to the first HSP. The HSF is located on the first HSP. The second HSP is flexible. Further, an elastic component is disposed between the first HSP and the second HSP. The second HSP is in contact with a heat source component (HSC). Thus, when the heat sink is placed on the HSC, the second HSP contacts the HSC, the second HSP is deformed because the heat sink and the HSC are pressed against each other, and the elastic component between the first HSP and the second HSP is compressed such that heat generated by the HSC is transferred to the heat sink.

Described herein is mechanically decoupling of an electromechanical transducer from a common substrate, enabling multiple transducers to be surface mounted to a common substrate such as a printed circuit board (PCB) without experiencing mechanical cross-coupling. The decoupling of the transducer from the substrate enables the transducers to be attached without reducing the efficiency of acoustic transduction. The design of the mount enables it to be assembled in an automated manner with pick and place tools.

An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.

The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.

A layered device having two base films, a conductive pattern attached to the first base film facing the second base film and a bonding layer binding the first base film and the second base film together. The bonding layer includes an opening, and the conductive pattern having an exposed portion aligned with the opening in the bonding layer. Further disclosed is a spacer attached to the first base film and the exposed portion of the conductive pattern, wherein the spacer fills at least part of the space created by the opening in the bonding layer. Also disclosed is a method of producing a layered device.

Provided is a display apparatus. The display apparatus includes: a display panel; a chassis supporting the display panel; a printed circuit board on which an electronic component is mounted; and a supporter inserted in the printed circuit board, wherein the printed circuit board includes a first surface facing the chassis, a second surface facing a direction opposite to the first surface, and a through hole penetrating the first surface and the second surface. The supporter includes: a head fixed on the second surface of the printed circuit board; a first body positioned inside the through hole, and extending from the head toward the chassis; and a second body extending from the first body, and protruding from the through hole toward the chassis.

A display apparatus and an antenna assembly are provided. The display apparatus includes: a display; a first circuit board including at least one electronic part configured to process an image signal for displaying an image on the display; a second circuit board including at least one antenna configured to transmit and receive a radio frequency (RF) signal for communication between the display apparatus and an external apparatus; and a spacer provided between the first circuit board and the second circuit board, and configured to space the first circuit board and the second circuit board apart from each other. Thus, radiation performance in the antenna is improved with easy design based on the structure of the display apparatus. Thus, radiation performance in the antenna is improved with easy design based on the structure of the display apparatus.

A printed circuit board (PCB) (4) including an upper surface having one or more electrical terminals (9) thereon, said terminal adapted for connection to corresponding terminal of one or more electrical components, and further including one or more platforms (10) fabricated thereon, said platforms being located adjacent to corresponding component terminals, said platforms being adapted to support an electrical component thereupon, such that a portion of the component overhangs said platform above said corresponding PCB terminal.

An object is to obtain a power conversion device that can suppress the generation of noise due to coupling and achieve the size reduction of a substrate. In a power conversion device, a main circuit wire for connecting main circuit components to form a main circuit includes a first main circuit wire and a second main circuit wire wired so as to be separated from each other on a substrate. A control wire is wired between the first main circuit wire and the second main circuit wire so as to be insulated therefrom, and the first main circuit wire and the second main circuit wire are connected to each other via the main circuit component placed so as to be separated from the control wire in the thickness direction of the substrate.