A tensioning frame (22) for tensioning a printing screen (3) comprises a plurality of elongate beams (30A-30D) which extend around the periphery of the printing screen (3) and define the tensioning frame (22), wherein at least one of the beams (30A-30D) comprises an opening (32) which is dimensioned to permit a printing screen (3) to be received therethrough, in a lateral direction (A). Mechanisms are described for engagement of the tensioning screen (22) and printing screen (3), as well as an apparatus and a method permitting the lateral loading of the printing screen (3).

An electric component includes a printed circuit board with each of a pair of surfaces serving as a component mounting surface. The component mounting surface has a predetermined region on which electronic components are coated with a resin. A predetermined one of the electronic components in the region is not covered with the resin at a portion above a predetermined height from the component mounting surface.

Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members. The method includes the steps of: laminating a laminate material LM including the support sheet 10 having the columnar metal members 14 formed thereon, a wiring board WB or a wiring board material WB′ having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16′ having a plurality of openings in portions corresponding to the columnar metal members 14 and containing a thermosetting resin such that the columnar metal members 14 are positioned in the respective openings; integrating the laminate material LM by heating and pressing to obtain a laminate LB including a thermosetting resin filled between an inner surface of each of the openings of the wiring board WB or the wiring board material WB′ and each of the columnar metal members 14; and peeling at least the support sheet 14 from the laminate LB.

Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

A framed stencil for surface mount technology (SMT) is provided. The frame assembly includes a frame member and a binding insert. The frame member includes an inner perimeter portion and an outer perimeter portion that cooperates with the inner perimeter portion to define an elongated channel. The outer perimeter portion includes a first cantilever portion that extends over the elongated channel and towards the inner perimeter portion. The binding insert is configured for releasable insertion into the elongated channel. The binding insert includes a base and a tongue. The base configured to interface with a mesh substrate to facilitate coupling therebetween. The tongue is coupled to the base and extends substantially horizontally from the base. When the binding insert is inserted into the elongated channel, the tongue extending beneath the first cantilever portion to facilitate retention of the binding insert to the frame member. Methods are also provided.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

An adhering jig includes a mounting plate having an upper surface, and a plurality of aligning parts incorporated in the mounting plate. A plurality of first holes are formed in the upper surface, and a plurality of first pins are engaged in the plurality of first holes, each having a base end and an upper end, and configured to be movable in a direction normal to the upper surface. A plurality of first adjusting members are located inward with respect to the upper surface. The plurality of first adjusting members are configured to support the plurality of first pins and to adjust movements thereof. The plurality of first adjusting members are, when the plurality of first pins are pressed in the first holes, configured to exert opposite force to the force applied through the plurality of first pins.

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.