A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.

A substrate includes electrically-conductive tracks. A semiconductor chip is arranged on the substrate and electrically coupled to selected ones of the electrically-conductive tracks. Containment structures are provided at selected locations on the electrically-conductive tracks, where the containment structures have respective perimeter walls defining respective cavities. Each cavity is configured to accommodate a base portion of a pin holder. These pin holders are soldered to the electrically-conductive tracks within the cavities defined by the containment structures. Each containment structure may be formed by a ring of resist material configured to receive solder and maintain the pin holders in a desired alignment position.

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

A stretchable mounting board that includes a stretchable substrate having a main surface, a stretchable wiring disposed on the main surface of the stretchable substrate, a mounting electrode section electrically connected to the stretchable wiring, solder electrically connected to the mounting electrode section and including bismuth and tin, and an electronic component electrically connected to the mounting electrode section with the solder interposed therebetween. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer.

This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending through the body of the heating plate and the heating plate being configured to supply hot air through the first air exits; a cover disposed on the heating plate, the cover and the heating plate defining a hot air chamber; a plurality of axially movable positioning shafts extending though the body of the heating plate, in which each shaft has a first end and a second end, the first end is in the hot air chamber, and the second end is outside the hot air chamber; and a conduit attached to the cover, the conduit being configured to supply hot air to the hot air chamber.

An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.

A module includes a PCB including a substrate, a component pad and at least one wire pad, an SMT component mounted to a component pad, a wire fence, a mold compound and a top conductive layer. Each wire pad is connected to ground by a corresponding via extending through the substrate, and the wire fence includes wire loops connected to each wire pad. The mold compound is disposed over the PCB, the SMT component and the wire fence, and defines multiple holes extending partially through the mold compound to top-edges of the wire loops, respectively, where a conductive material fills the holes. The top conductive layer is disposed over the mold compound, and is in electrical contact with the conductive material filling the holes. The wire fence, the conductive material, and the top conductive layer provide shielding of the SMT component from electromagnetic radiation.

A stretchable mounting board that includes a mounting electrode section electrically connected to stretchable wiring, and solder electrically connected to the mounting electrode section. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer, and the concentration of the bismuth in the second electrode layer is constant along a thickness direction thereof.

A stretchable mounting board that includes a stretchable substrate having a main surface, a stretchable wiring disposed on the main surface of the stretchable substrate, a mounting electrode section electrically connected to the stretchable wiring, solder electrically connected to the mounting electrode section and including bismuth and tin, and an electronic component electrically connected to the mounting electrode section with the solder interposed therebetween. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer.

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.