A printed wiring board includes a base material, a plurality of electrode pads to which an electronic component is soldered, the electrode pads being formed on a surface of the base material, a molten-solder introducing protrusion formed on the surface of the base material and connected to each of the electrode pads to draw molten solder into the electrode pad during soldering, and a molten-solder separating protrusion formed on the surface of the base material and connected to each of the electrode pads to help separation of molten solder from the electrode pad at a moment of separation of molten solder, wherein the molten-solder introducing protrusion, the electrode pad, and the molten-solder separating protrusion are aligned in line.

The invention relates to a process to connect, by soldering, at least one electronic component (104, 204, 304, 404, 504) with a mounting plate (100, 200, 300, 400, 500), the mounting plate having at least one mounting plate contact surface (102, 202, 302, 402, 502) and the at least one electronic component having at least one component contact surface (105) corresponding to it, the at least one mounting plate contact surface being surrounded by a solder resist layer (101, 201, 301, 401, 501) that borders the at least one mounting plate contact surface, the process having the following steps: a) Applying solder paste (106, 206, 306, 406, 506) onto at least areas of the solder resist layer (101, 201, 301, 401, 501), minimally overlapping with the mounting plate contact surface (102, 202, 302, 402, 502) adjacent to the solder resist layer, b) Equipping the mounting plate with the at least one electronic component (104, 204, 304, 404, 504), the at least one component contact surface (105) at least partly covering the at least one mounting plate contact surface (102, 202, 302, 402, 502) corresponding to it; and c) Heating the solder paste (106, 206, 306, 406, 506) to produce a soldered connection between the mounting plate and the at least one component.

A control unit that controls a motor includes a semiconductor device, the semiconductor device includes a semiconductor package including a plurality of first electrodes, a wiring board including a plurality of second electrodes arranged so as to correspond to each of the plurality of first electrodes, and solder joints connecting the plurality of first electrodes and the plurality of second electrodes, and a tip end of a second electrode arranged at an outermost corner of the wiring board is located outside an outer peripheral end of the semiconductor package.

The invention relates to a motor-vehicle headlamp (1), comprising at least one LED (4; 4a, 4d), which is attached by soldering, as an SMD, to metal surfaces (3-1, 3-2) of a printed circuit board (3) at connection points of said LED, and comprising an optical unit (2; 8), which emits the light emitted by the at least one LED into the traffic space, wherein, in order to set the emission direction of the at least one LED in a specific manner, said LED is attached by soldering with different solder thicknesses (d1, d2) between the connection points (4-1, 4-2) of said LED and the metal surfaces of the printed circuit board.

A printed circuit board (1) comprising an insulating layer (2) and a conducting layer (3) arranged on the insulating layer (2) and structured into a contact surface (4) for an electronic component (11) which is to be populated on the printed circuit board (1) has, in the area of the contact surface (4), at least one channel (8) that passes through the contact surface (4) and the insulating layer (2) and that is filled with a thermally conductive material. The process is characterized by the steps of preparing an insulating layer (2) and a conducting layer (3) connected with the insulating layer (2); producing at least one channel (8) passing through the conducting layer (2) and the insulating layer (3); lining the channel (8) with thermally conductive material; structuring the conducting layer (3) into a contact surface (4) for an electronic component (11) to be populated on the printed circuit board; preparing a solder deposit (9) at least minimally overlapping with the contact surface (4); setting down the electronic component (11); melting the solder, and cooling.

A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.

A printed circuit board (1) comprising an insulating layer (2) and a conducting layer (3) arranged on the insulating layer (2) and structured into a contact surface (4) for an electronic component (11) which is to be populated on the printed circuit board (1) has, in the area of the contact surface (4), at least one channel (8) that passes through the contact surface (4) and the insulating layer (2) and that is filled with a thermally conductive material. The process is characterized by the steps of preparing an insulating layer (2) and a conducting layer (3) connected with the insulating layer (2); producing at least one channel (8) passing through the conducting layer (2) and the insulating layer (3); lining the channel (8) with thermally conductive material; structuring the conducting layer (3) into a contact surface (4) for an electronic component (11) to be populated on the printed circuit board; preparing a solder deposit (9) at least minimally overlapping with the contact surface (4); setting down the electronic component (11); melting the solder, and cooling.

The invention relates to a process to connect, by soldering, at least one electronic component (104, 204, 304, 404, 504) with a mounting plate (100, 200, 300, 400, 500), the mounting plate having at least one mounting plate contact surface (102, 202, 302, 402, 502) and the at least one electronic component having at least one component contact surface (105) corresponding to it, the at least one mounting plate contact surface being surrounded by a solder resist layer (101, 201, 301, 401, 501) that borders the at least one mounting plate contact surface, the process having the following steps: a) Applying solder paste (106, 206, 306, 406, 506) onto at least areas of the solder resist layer (101, 201, 301, 401, 501), minimally overlapping with the mounting plate contact surface (102, 202, 302, 402, 502) adjacent to the solder resist layer, b) Equipping the mounting plate with the at least one electronic component (104, 204, 304, 404, 504), the at least one component contact surface (105) at least partly covering the at least one mounting plate contact surface (102, 202, 302, 402, 502) corresponding to it; and c) Heating the solder paste (106, 206, 306, 406, 506) to produce a soldered connection between the mounting plate and the at least one component.