A method for producing a conductive liquid electrophotographic ink composition is described, the method comprising: heating a polymer resin in a carrier fluid to dissolve the polymer resin; adding conductive metallic pigment particles to be coated to the carrier fluid; cooling the carrier fluid to effect precipitation of the polymer resin from the carrier fluid such that a coating of the resin is at least partially formed on the conductive metallic pigment particles; reheating the suspension of partially coated conductive metallic pigment particles in the carrier fluid; and cooling the carrier fluid at a controlled rate to effect precipitation of the polymer resin from the carrier fluid such that a coating of the resin is formed on the conductive metallic pigment particles, thereby producing the conductive liquid electrophotographic ink composition.

In a method and an apparatus for forming on a substrate (214) a pattern of a material, a material layer is provided on an intermediate carrier (204) and an adhesive layer is provided on the material layer, wherein at least one of the material layer or the adhesive layer comprises a pattern corresponding to the pattern to be formed on the substrate (214). The material is transferred to the substrate (214) with the adhesive fixing the material to a surface (216) of the substrate (214).

A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

A method of producing a foil formed member, includes: preparing a formed member on which a plastic toner image having plasticity is formed; and pressing foil against the formed member at a temperature of 70 C. or lower to form a foil image on the plastic toner image of the formed member, and a method of producing a wiring substrate, includes: preparing a substrate on which a toner image of a toner, in which a volume fraction of particles having a particle diameter of 16 m or more is less than 1%, is formed; and forming a foil image on the toner image of the substrate.

In a method and an apparatus for forming on a substrate (214) a pattern of a material, a material layer is provided on an intermediate carrier (204) and an adhesive layer is provided on the material layer, wherein at least one of the material layer or the adhesive layer comprises a pattern corresponding to the pattern to be formed on the substrate (214). The material is transferred to the substrate (214) with the adhesive fixing the material to a surface (216) of the substrate (214).

A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 m to 2 m on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.

A method for forming on a substrate (108; 214) a pattern of a material, the method comprising: providing (S100) a material layer (104); providing (S104, S106) an adhesive layer (106), wherein at least one of the material layer (104) or the adhesive layer (106) comprises a pattern corresponding to the pattern to be formed on the substrate (108; 214); and transferring (S108) the material to the substrate (108; 214) with the adhesive fixing the material to a surface (110; 216) of the substrate (108; 214). This solves the problem of forming on a substrate a pattern of a material that, in general, cannot be applied to the substrate directly due to the fact that the material cannot be printed and/or has no or reduced adherence properties with respect to the substrate.

A method of producing a foil formed member, includes: preparing a formed member on which a plastic toner image having plasticity is formed; and pressing foil against the formed member at a temperature of 70 C. or lower to form a foil image on the plastic toner image of the formed member, and a method of producing a wiring substrate, includes: preparing a substrate on which a toner image of a toner, in which a volume fraction of particles having a particle diameter of 16 m or more is less than 1%, is formed; and forming a foil image on the toner image of the substrate.

A solvent-free method for fabricating conductors is disclosed. A thick patterned layer up to 13 microns containing metal precursor and reducing agent precursor are initially deposited onto a substrate using laser printing technology. The deposited patterned precursor materials are then irradiated with a newly developed high energy intense pulsed light (IPL) system in order to transform the deposited materials to thick conductive metal patterns. The easy metallization of printed patterns makes this invention an especially effective method for massive production of flexible printed circuits.