Patent classifications
H05K2203/0534
Methods for printing solder paste and other viscous materials at high resolution
Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
Device for manufacturing conductive film
Provided is a device configured to manufacture a conductive film including a rotating member, a first syringe, and a second syringe. The rotating member rotates about an axis extending in a first direction. The first syringe is disposed over a first portion of the rotating member, and is configured to discharge a first polymer and conductive balls. The second syringe is adjacent to the first syringe, and is configured to discharge a second polymer.
REEL-TO-REEL SURFACE PRESS APPARATUS
Disclosed in a reel-to-reel surface press apparatus. The reel-to-reel surface press apparatus includes an uncoiler and a recoiler, both transferring a component in a reel-to-reel method, a press disposed between the uncoiler and the recoiler, comprising a press plate pressing the component, and having a plurality of reference holes at an equal pitch along an edge of the press plate, a feeder disposed at the rear of the uncoiler and moving the component, and a controller configured to control the component to be transferred based on at least any one of the plurality of reference holes.
Application of Electrical Conductors of a Solar Cell
A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).
METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HIGH RESOLUTION
Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
A stretchable circuit board includes plural stretchable bases, and plural stretchable wiring portions, at least one of which is provided on each of main surfaces, facing each other, of the plural stretchable bases, in which the stretchable wiring portions provided on the main surfaces are electrically continuous with each other through a connecting portion.
Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connector
Methods for securely transferring and attaching electrically conductive particles filled in openings to a binder resin layer. The methods include a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.
UV-curable ink composition, method for producing bezel pattern of display substrate using same, and bezel pattern produced thereby
The present invention relates to a UV-curable ink composition, a method for producing a bezel pattern of a display substrate using same, and a bezel pattern produced thereby, the UV-curable ink composition comprising a colorant, an epoxy resin, an oxetane resin, a photopolymerization initiator, and a surfactant comprising a polar functional group, wherein the content ratio of the epoxy resin to the oxetane resin is 1:0.5-1:6.
Systems for printing solder paste and other viscous materials at high resolution
Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
Wiring structure manufacturing method and wiring structure
A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.