A laminator is disclosed. The laminator includes a substrate supply part for supplying a substrate on which a metal pattern is formed; a coverlay supply part for supplying a film to which a plurality of coverlays is attached; a heating roller part for bonding the substrate and the film so that the plurality of coverlays respectively covers the metal pattern; a substrate tension adjustment part and a film tension adjustment part; a bonding state image photographing part for measuring an interval between the plurality of coverlays after the substrate and the film are bonded; and an adjustment part for adjusting the substrate tension adjustment part or the film tension adjustment part so that the interval between the plurality of coverlays measured by the bonding state image photographing part maintains a preset allowable interval.

An object of the present invention is to provide: a heat-curable composition capable of yielding a cured article in which crack generation during a heating-cooling cycle can be inhibited; a dry film thereof; and a printed wiring board comprising the cured article. The heat-curable composition is characterized by comprising a semisolid or a solid epoxy compound and a curing accelerator that is made miscible with the epoxy compound when heated at 130 to 220° C. The dry film comprises a resin layer formed from this heat-curable composition, and the printed wiring board comprises a cured article obtained from the heat-curable composition or the dry film.

An object of the present invention is to provide: a dry film comprising a resin layer which has excellent detachability from a carrier film and in which cracking and powdering are inhibited; and a printed wiring board comprising a cured article obtained by curing the dry film. The dry film comprises a resin layer containing a thermosetting resin component, a filler and at least two solvents, wherein the at least two solvents both have a boiling point of 100° C. or higher and the boiling points of the at least two solvents are different by not less than 5° C.

A ceramic substrate includes an electrode on an electronic component mounting surface. A resist dividing the electrode into a plurality of electrode pieces by extending across the electrode is disposed on the electronic component mounting surface. Two of the electrode pieces may be connected to each other by a portion of the electrode that is concealed under the resist.

A ceramic substrate according to the present disclosure includes a plurality of electrodes on an electronic component mounting surface, and one or more interelectrode wires that connect the electrodes to each other on the electronic component mounting surface. A resist that extends across the interelectrode wire is disposed on the electronic component mounting surface.

A method produces a conductive paste comprising 15-20% by weight of PDMS and 80-85% by weight of metallic micro-nano particles, wherein the conductive paste is obtained by repeated addition of singular doses of PDMS to a heptane diluted PDMS low viscosity liquid containing the metallic micro-nano particles, wherein the heptane fraction is allowed to evaporate after addition of each of the singular doses of PDMS. A method forms a conductive path on a support layer, wherein the conductive path is encapsulated by an encapsulation layer comprising at least one via through which at least one portion of the conductive path is exposed, the method comprising filling the at least one via with the conductive paste.

A ceramic substrate according to the present disclosure includes a plurality of electrodes on an electronic component mounting surface, and one or more interelectrode wires that connect the electrodes to each other on the electronic component mounting surface. A resist that extends across the interelectrode wire is disposed on the electronic component mounting surface.

A resin film configured to hold a conductive metallic track against a panel. The resin film partially covers the conductive metallic track, such that the conductive metallic track has at least one region which does not have the resin film, so as to allow an electrical connection by contact. Thus, in the context of assembly on a panel, the metallic track incorporated between the panel and the resin film is protected, thus rendering this technical solution particularly robust. Furthermore, the resin film electrically insulates the metallic track from surrounding elements, and the regions which do not have resin film allow an electrical connection by contact.

A resin film configured to hold a conductive metallic track against a panel. The resin film partially covers the conductive metallic track, such that the conductive metallic track has at least one region which does not have the resin film, so as to allow an electrical connection by contact. Thus, in the context of assembly on a panel, the metallic track incorporated between the panel and the resin film is protected, thus rendering this technical solution particularly robust. Furthermore, the resin film electrically insulates the metallic track from surrounding elements, and the regions which do not have resin film allow an electrical connection by contact.

A manufacturing method for an electronic device according to the present disclosure includes (i) forming an insulating film on a surface of a cylinder, (ii) forming the insulating film having a via hole on the surface of the cylinder by pressing a relief member against the insulating film to remove a portion of the insulating film facing a protrusion of the relief member, and (iii) providing a precursor of an insulating layer having the via hole filled with conductive ink on a wiring substrate, wherein the via hole faces a wiring of the wiring substrate.