An electronic component including: an electronic component body; at least one electrode on a surface of the electronic component body; and a cover layer having insulating properties on at least a part of a periphery of the electrode and extending across a boundary between the periphery of the electrode and the surface of the electronic component body, wherein the electrode includes, on the at least part of the periphery, a lower electrode closer to the surface of the electronic component body and an upper electrode on the lower electrode, the lower electrode extends more outward than the upper electrode to create a step at the at least part of the periphery of the electrode, and at the step at the periphery of the electrode, the cover layer extends from a surface of the upper electrode to a portion with no electrodes on the surface of the electronic component body.

The invention relates to a method for soldering an SMD component (1) to a circuit carrier (2) in a positionally stable manner, having the following steps: a) providing a circuit carrier (2) comprising at least one printed circuit board contact surface (2a), which is coated with a soldering paste (3) and which is designed to electrically, thermally and/or mechanically contact the SMD component (1) to be connected, wherein a number of filled vias (6), which cannot be coated with molten solder, pass through the circuit carrier (2) at least in the region of the printed circuit board contact surface (2a), b) applying at least one adhesive point (4a, 4b, 4c, 4d, 4e) onto the circuit carrier (2) such that the adhesive point (4a, 4b, 4c, 4d, 4e) delimits the printed circuit board contact surface (2a) coated with soldering paste (3) on at least one side of an edge point (R.sub.a, R.sub.b) paired with the soldering paste (3), c) placing an SMD component (1), which comprises at least one component contact surface (1a), on the printed circuit board contact surface (2a) coated with soldering paste (3) such that the at least one component contact surface (1a) electrically, thermally and/or mechanically contacts the printed circuit board contact surface (2a) via the soldering paste (3) lying therebetween, said placement being carried out and the position of said at least one adhesive point (4a, 4b, 4c, 4d, 4e) being selected in step b) such that the SMD component (1) rests on the soldering paste (3) without contacting the at least one adhesive point (4a, 4b, 4c, 4d, 4e), d) waiting for a specifiable duration t until a curing process of the at least one adhesive point (4a, 4b, 4c, 4d, 4e) is complete, and e) heating, melting and subsequently cooling the soldering paste (3) in order to produce an electric, thermal and/or a mechanical connection between the at least one component contact surface (1a) of the SMD component (1) and the at least one printed circuit board contact surface (2a) of the circuit carrier (2), wherein a barrier (5) is formed using the at least one adhesiv

A light emitting device includes: a substrate; one or more LED (light emitting diode) elements mounted on a substrate; and a radiator unit made of metal paste and arranged on a rear surface opposite to a principal surface on which the one or more LED elements are mounted. The height Ta of the radiator unit from a rear surface is less than thickness Tb of substrate.

The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.

Methods for securely transferring and attaching electrically conductive particles filled in openings to a binder resin layer. The methods include a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

A patterning paste is disclosed for patterning metal nanowires, the patterning paste including a complexing agent containing guanidine thiocyanate. A method of selectively patterning a substrate having metal nanowires includes: providing a substrate having a surface bearing metal nanowires; and selectively applying the patterning paste to the substrate such that the metal nanowires are selectively cut into a pattern. A consumer electronic product includes: a substrate having a surface bearing metal nanowires. The metal nanowires of the substrate are selectively patterned by applying the patterning paste to the substrate such that the metal nanowires are selectively cut into the pattern.

An aliphatic polycarbonate resin for forming a partition containing a constituent unit represented by the formula (1): ##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are each independently a hydrogen atom, an alkyl group having one or more carbon atoms, an alkoxyalkyl group having two or more carbon atoms, an aryl group, or an aryloxyalkyl group; at least one of R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is an alkyl group having two or more carbon atoms, an alkoxyalkyl group having two or more carbon atoms, an aryl group, or an aryloxyalkyl group; and R.sup.1, R.sup.2, R.sup.3, and R.sup.4 may be the same or different; and the aliphatic polycarbonate resin has a contact angle against water of 75° or more. Also disclosed is a partition material including the aliphatic polycarbonate resin, a substrate, a method of producing the substrate, a method for producing a wiring substrate, and a wiring forming method.

A method for depositing a material to join two surfaces of an electronic assembly includes determining, using dimensions of a pad area of a substrate, a deposition pattern for the material that extends across the pad area of the substrate. The method further includes creating a tool to deposit the material in the deposition pattern that extends across the pad area of the substrate.