Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

The present invention relates to an electrochemical or chemical treatment device for high aspect ratio circuit board with through hole comprises: an electroplating tank; a solution storage tank; a positioning frame, the positioning frame fixes the circuit board inside the electroplating tank for the electroplating tank to be divided into a solution accumulated area and a suction area by the positioning frame and the circuit board; a priming piping sucking solution from the solution storage tank to the solution accumulated area; a suction cap corresponding to the suction area; and a suction piping connected to the suction cap, using the negative pressure produced by suction to make the solution flow through the through hole of the circuit board, and further having a better result of electroplating the bore of through hole of the high aspect ratio circuit board.

In one embodiment, the disclosed apparatus features a conveyor belt though an agitated reservoir of cleaning solution that is pooled by a flood box defined by sidewalls along the sides of the conveyor belt and opposing jets of water dubbed water curtains at the entrance and exit of the conveyor belt to and from the flood box, and, agitated by a plurality of spray nozzles shooting high flows of cleaning solution into the reservoir from above or within the flood box. The conveyor belt may be horizontal or slightly angled from the horizontal relative to the flood box.

Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool.

Glass substrate assemblies having low dielectric properties, electronic assemblies incorporating glass substrate assemblies, and methods of fabricating glass substrate assemblies are disclosed. In one embodiment, a substrate assembly includes a glass layer 110 having a first surface and a second surface, and a thickness of less than about 300 m. The substrate assembly further includes a dielectric layer 120 disposed on at least one of the first surface or the second surface of the glass layer. The dielectric layer has a dielectric constant value of less than about 3.0 in response to electromagnetic radiation having a frequency of 10 GHz. In some embodiments, the glass layer is made of annealed glass such that the glass layer has a dielectric constant value of less than about 5.0 and a dissipation factor value of less than about 0.003 in response to electromagnetic radiation having a frequency of 10 GHz. An electrically conductive layer 142 is disposed on a surface of the dielectric layer, within the dielectric layer or under the dielectric layer.