Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.

A method for producing flexible conductive printed circuit with a printed overcoat is disclosed. For example, the method includes forming conductive printed circuit lines on a flexible substrate, detecting locations on the flexible substrate where the conductive printed circuit lines are formed, and printing an overcoat over the conductive printed circuit lines at the locations that are detected on the flexible substrate, wherein the overcoat comprises a mixture of thermoplastic polyurethane (TPU) and a solvent having a viscosity of 1 centipoise to 2,000 centipoise to allow the mixture to be printed.

A method for producing flexible conductive printed circuit with a printed overcoat is disclosed. For example, the method includes forming conductive printed circuit lines on a flexible substrate, detecting locations on the flexible substrate where the conductive printed circuit lines are formed, and printing an overcoat over the conductive printed circuit lines at the locations that are detected on the flexible substrate, wherein the overcoat comprises a mixture of thermoplastic polyurethane (TPU) and a solvent having a viscosity of 1 centipoise to 2,000 centipoise to allow the mixture to be printed.

This invention forms a multilayer substrate by one apparatus. A multilayer substrate forming method includes fixing a substrate on a stage, forming, on the substrate fixed on the stage, a layer of a mixed material obtained by mixing a conductive material and a photo-curing resin, performing exposure by scanning a laser beam according to first circuit pattern data prepared in advance on the layer of the mixed material, washing away the mixed material on the substrate after the exposure in the performing exposure by scanning the laser beam according to the first circuit pattern data, forming a layer of an insulating resin on the substrate after the cleaning in the washing away the mixed material on the substrate after the exposure in the performing exposure by scanning the laser beam according to the first circuit pattern data, performing exposure by scanning a laser beam according to through hole data prepared in advance on the layer of the insulating resin, washing away the insulating resin on the substrate after the exposure in the performing exposure by scanning the laser beam according to the through hole data, forming a layer of the mixed material on the substrate after the cleaning in the washing away the insulating resin, performing exposure by scanning a laser beam according to second circuit pattern data prepared in advance on the layer of the mixed material, and washing away the mixed material on the substrate after the exposure in the performing exposure by scanning the laser beam according to the second circuit pattern data.

An electrical module and a circuit board arrangement including an electrical module are disclosed. The electrical module includes an upper side and an underside, the upper side having four rectangularly arranged side edges, an electrical component embedded in the electrical module, and at least three electrical solder pads formed on the upper side configured to make electrical contact with the electrical component and configured to come into contact with an associated electrical solder pad of a circuit board via a solder layer. The solder pads of the electrical module are arranged in a symmetrical arrangement on the upper side of the electrical module, and/or the solder pads are arranged axially symmetrically on the upper side of the electrical module, and/or the solder pads extend along two opposite side edges on the upper side of the electrical module.

Embodiments are directed to short and/or near short etch rework. A microfluidic device is positioned on a portion of a circuit having a defect. The microfluidic device is caused to dispense etchant that removes the defect of the circuit, where a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit. The microfluidic device is used to extract the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit. The microfluidic device is removed from the circuit.

A control system for a fluxer, the control system comprising: a variable speed pump configured to provide pressurised flow of liquid flux from a flux supply tank; a pulse-width-modulated (PWM) valve coupled to the variable speed pump; a jet nozzle coupled to the PWM valve and configured to eject a jet of flux drops onto a substrate to form flux points, lines or areas thereon; and a controller coupled to the variable speed pump and the PWM valve; wherein the controller is configured to generate PWM signals to control the PWM valve, and pump speed signals to control the variable speed pump, to thereby selectively and individually control volume of individual flux drops, and pressure and flow of the liquid flux, to form the flux points, lines or areas on the substrate.

A method of manufacturing is provided that includes singulating a circuit board from a substrate of plural of the circuit boards, wherein the circuit board is shaped to have four corner hollows. The corner hollows may be various shapes.

An electronic device is described that is designed to be more easily recycled at its end of life while maintaining usability during its lifetime. The electronic device includes a first substrate, an encapsulation layer, and a set of electronics disposed there between. One or more delamination layers cover at least one side, preferably both sides, of the set of electronics to separate the set of electronics from at least one, preferably both, of the first substrate and the encapsulation layer. The set of electronics, covered by the one or more delamination layers, is encapsulated between the encapsulation layer and the first substrate. At least one of the delamination layers includes a set of passages filled with material of the encapsulation layer forming a set of interconnections between the encapsulation layer and the first substrate.

A cleaning apparatus is configured to clean electronic substrates including printed circuit boards and semiconductor product assemblies. The cleaning apparatus includes at least one cleaning module configured to treat electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a spray system having a manifold connected to a source of fluid and a plurality of spray bars fluidly coupled to the manifold, and an adjustable height spray system configured to move the manifold and the plurality of spray bars up and down with respect to the conveyor system.