A cleaning apparatus is provided. This cleaning apparatus includes an inlet, an outlet, a first conveyance path, a second conveyance path, a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner, and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner. The first conveyance path and the second conveyance path are vertically arranged side by side. The second conveyance path is positioned above the first conveyance path and connected with the outlet at an end point. The second conveyance path functions as a stocker configured to temporarily store the target object.

A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.

The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.

A dispensing control system, including a frame component having a first side surface and a second side surface, a first sensor portion positioned proximate the first side surface, and a second sensor portion positioned proximate the second side surface, the second sensor portion being separated from the first sensor portion a distance to allow a liquid spray stream exiting a dispenser of a conformal coating machine to pass therebetween, wherein the first sensor portion transmits a beam of light towards the second sensor portion to measure the liquid spray stream exiting the dispenser, the beam of light encompassing both edges of the liquid spray stream while the dispenser is stationary, is provided. Furthermore, an associated method is also provided.

Disclosed is a surface treatment device. The surface treatment device includes: a frame; a disc hanger; two support wheels for supporting the disk hanger; a rotation drive mechanism for driving the disk hanger supported on the two support wheels to rotate; a vertical spray rack for spraying liquid medicine on the circuit board on the disk hanger; and a lift mechanism for driving the vertical spray rack up and down.

The present application provides binary azeotrope or azeotrope-like compositions comprising perfluoroheptene and an additional component, wherein the additional component is present in the composition in an amount effective to form an azeotrope composition or azeotrope-like composition with the perfluoroheptene. Methods of using the compositions provided herein in cleaning and carrier fluid applications are also provided.

An etching device includes a nozzle unit including at least one nozzle including an etching solution injection hole, an etching solution collection hole, and a sealing part. The etching solution injection hole is configured to provide an etching solution to an etching object, the etching solution collection hole is configured to collect the etching solution, and the sealing part surrounds the etching solution injection hole and the etching solution collection hole to prevent the etching solution from leakage.

Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

The present application provides binary azeotrope or azeotrope-like compositions comprising perfluoroheptene and an additional component, wherein the additional component is present in the composition in an amount effective to form an azeotrope composition or azeotrope-like composition with the perfluoroheptene. Methods of using the compositions provided herein in cleaning and carrier fluid applications are also provided.

A manufacturing method for a printed circuit board includes: transferring roughness of a metal film to an insulating layer by laminating the metal film on the insulating layer, the metal film having the roughness formed on one surface thereof and having a discrete metal layer laminated thereon; exposing a surface of the insulating layer, on which the roughness is transferred, by removing the metal film; processing the surface of the insulating layer having the roughness formed thereon with an acidic solution; and forming a circuit pattern on the insulating layer by a plating process.