A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

It is proposed to provide a transfer method of a high viscosity functional material, such as a conductive paste, onto a receiving substrate, the method comprising the steps of: providing a plate having a cavity surface that includes at least one cavity; providing the cavity with a resistive heating device and control circuitry connected to the heating device; providing a functional material in the at least one cavity, having a material composition that, when heated by the heating device, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the at least one cavity by the gas generation onto the receiving substrate.

Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a substrate, curing the solder paste below a reflow temperature of the solder to form a solid composite hybrid bump on the conductive pads, forming a molding compound around the solid composite hybrid bump, and reflowing the hybrid bump, wherein the sacrificial polymer is substantially decomposed.

The present application discloses a filtering cable, which solves the problem that the cable in the related art cannot ensure a simple and reasonable structural design while having good filter performance. One or several core wires and N defective conductor layers surrounding the core wires are sequentially provided from inside to outside in the cross section in the radial direction of the filtering cable; wherein the defective conductor layer has an etching pattern; the etching pattern is distributed in the axial direction of the filtering cable; the etching pattern is used to make the filtering cable equivalent to a preset filter circuit to filter the signal transmitted in the filtering cable.

A stretchable sensor includes a stretchable layer including an elastomer, and a conductive layer at least partially buried in the stretchable layer and including a conductive nanostructure. The stretchable layer includes a plurality of first regions including a ferromagnetic material buried in the elastomer, and a second region excluding the plurality of first regions.

The present application discloses a filtering cable, which solves the problem that the cable in the related art cannot ensure a simple and reasonable structural design while having good filter performance. One or several core wires and N defective conductor layers surrounding the core wires are sequentially provided from inside to outside in the cross section in the radial direction of the filtering cable; wherein the defective conductor layer has an etching pattern; the etching pattern is distributed in the axial direction of the filtering cable; the etching pattern is used to make the filtering cable equivalent to a preset filter circuit to filter the signal transmitted in the filtering cable.

The invention includes methods of forming electronic circuitry on a target surface using intense pulsed light-induced mass transfer (IPLMT) of metal nanoparticles (NPs) by applying a pliable mask to a target surface, coating a carrier film with metal NPs, mounting the carrier film to the target surface and over the pliable mask so that the pliable mask is sandwiched between the target surface and the metal NPs. and exposing the metal NPs to light energy to cause atoms of the metal NPs to evaporate and transport through openings of the pliable mask and condense on the target surface, producing a conductive pattern of condensed metal on the target surface. Certain implementations may utilize a kirigami-patterned pliable mask to enhance conformity to a freeform 3D target surface. In certain implementations, zinc (Zn) may be formed by IPLMT of Zn NPs to the target surface.

An electronic device having a substrate with a metal structure, a mono-layer coating of a selected silane composition on a surface of the metal structure, and an organic layer on the mono-layer coating, wherein the mono-layer coating improves the interfacial adhesion strength between the metal surface and the organic material.

A wiring substrate includes a first build-up part including a first conductor layer, a first insulating layer, and first via conductors penetrating through the first insulating layer, a second build-up part including second conductor layers, second insulating layers, and second via conductors penetrating though the second insulating layers, a third build-up part including a third conductor layer, a third insulating layer, and third via conductors penetrating through the third insulating layers such that the second built-up part is formed between the first built-up part and the third build-up part. The first, second and third build-up parts are formed such that a diameter of each of the first via conductors is smaller than a diameter of each of the second via conductors and that the diameter of each of the second via conductors is smaller than a diameter of each of the third via conductors.

The invention includes methods of forming electronic circuitry on a target surface using intense pulsed light-induced mass transfer (IPLMT) of metal nanoparticles (NPs) by applying a pliable mask to a target surface, coating a carrier film with metal NPs, mounting the carrier film to the target surface and over the pliable mask so that the pliable mask is sandwiched between the target surface and the metal NPs. and exposing the metal NPs to light energy to cause atoms of the metal NPs to evaporate and transport through openings of the pliable mask and condense on the target surface, producing a conductive pattern of condensed metal on the target surface. Certain implementations may utilize a kirigami-patterned pliable mask to enhance conformity to a freeform 3D target surface. In certain implementations, zinc (Zn) may be formed by IPLMT of Zn NPs to the target surface.