A device for inserting a flexible printed circuit board into a connector of a display panel includes: a suction unit configured to adhere to the flexible printed circuit board; a position restriction unit configured to restrict a position of the flexible printed circuit board; and a flexible printed circuit board transfer unit coupled to the suction unit and the position restriction unit, and configured to insert the flexible printed circuit board into the connector. A method of inserting a flexible printed circuit board into a connector of a display panel is also disclosed.

The method for removing partial metal wall of hole of the present invention includes the following steps. First, a circuit board is provided. The circuit board includes a plurality of circuit layers, a plurality of dielectric layers, and a plated through hole. Each of the dielectric layers is between two adjacent circuit layers. The wall of the plated through hole includes at least one residual copper. The circuit layer immediately below the residual copper is defined as a signal layer. Next, a position of the signal layer and a position of the residual copper in the plated through hole are obtained. Next, a drill is provided, the drill includes a main body and at least one needle, and the drill is moved to the position of the residual copper. The main body is rotated around the central axis of the main body, so the needle can remove part of the residual copper.

A method of forming a structure upon a substrate is disclosed. The method comprises: providing a substrate upon a surface of which a plurality of electrically conductive pads are disposed; depositing fluid containing a dispersion of electrically polarizable nanoparticles onto the substrate such that at least a portion of a first one of the plurality of pads is in contact with the fluid; applying an alternating electric field to the fluid using a first electrode and a second electrode, the first electrode being positioned so as to provide an effective first electrode end position from which the electric field is applied, coincident with the deposited fluid, and spaced apart from the first pad by a distance, and the second electrode being in contact with the first pad, such that a plurality of the nanoparticles are assembled to form a first elongate structure extending along at least part of the distance between the effective first electrode end position and the portion of the first pad.

In a method for jetting a droplet of an electrically conductive fluid, a Lorentz force is generated in the electrically conductive fluid. The Lorentz force is directed into an actuation direction. The actuation direction is a direction opposite to the droplet ejection direction. A jetting device is provided for printing a droplet of an electrically conductive fluid.

The present disclosure provides a first method for updating firmware of a computer system, which is embedded in a technical device, wherein the technical device has a volatile memory module, wherein the technical device has a non-volatile memory module, in which a firmware update package is stored, wherein the firmware update package contains individual files and associated first checksums, wherein the method runs through the following steps in the specified sequence: a restart (G), a subsequent booting of the computer system (H), and checking if an indicator file exists in the non-volatile memory module (I). Also provided is a second method for updating firmware of the computer system, which is embedded in a technical device, wherein the method runs through the following steps in the specified sequence: a restart (G), a subsequent booting of the computer system (H), and a check as to whether an indicator file exists in the non-volatile memory module (I).

A method of forming an electrically conductive composite is disclosed that includes the steps of providing a first dielectric material and a second conductive material that is substantially dispersed within the first dielectric material; and applying an electric field through at least a portion of the combined first dielectric material and second conductive material such that the second conductive material undergoes electrophoresis and forms at least one electrically conductive path through the electrically conductive composite along the direction of the applied electric field.

An anisotropic conductive film (ACF), a bonding structure, and a display panel, and their fabrication methods are provided. The ACF includes a resin gel and a plurality of conductive particles dispersed in the resin gel. The plurality of conductive particles is aligned and connected, in response to an electric field, to form a conduction path in the resin gel. The bonding structure includes the anisotropic conductive film (ACF) sandwiched between first and second substrates. The display panel includes the bonding structure.

A display device includes a display panel including a plurality of pad electrodes, a driving member attached to the display panel and including a plurality of bumps facing the plurality of pad electrodes, respectively, a plurality of conductive particles interposed between the display panel and the driving member, and a plurality of alignment electrodes separated from the plurality of pad electrodes and the plurality of bumps, where an opening is defined in at least one of a pad electrode of the plurality of pad electrodes and a bump of the plurality of bumps includes an opening, and an alignment electrode of the plurality of alignment electrodes is disposed in the opening.

Disclosed are examples for printing a one-dimensional (1D) nanomaterial for use in stretchable electronic devices. An ink comprising a nanomaterial solution is dispersed from a pneumatic dispensing system of a printing device. The 1D nanomaterial is printed in a predefined pattern on an underlying substrate positioned on a ground electrode. A voltage is applied between the printing nozzle and the ground electrode to cause the ink to form into a cone during the printing. The substrate can be modified to increase the wettability of the substrate to enhance adhesion of the ink to the substrate.

A substrate plating method includes forming a first resist film exposing a first feeding layer on a first face of a substrate; forming a second resist film exposing a second feeding layer on a second face of the substrate opposite to the first face; holding the substrate with a clamp member in such a manner that the clamp member is in contact with the first feeding layer and the second feeding layer, and arranging a first electrode in opposed relation with the first face and a second electrode in opposed relation with the second face; and forming a plating layer on a plating-scheduled region of the first face under conditions in which a value of current supplied between the second face and the second electrode is larger than a value of current supplied between the first face and the first electrode.