Embodiments include a reflowable grid array (RGA) interposer, a semiconductor packaged system, and a method of forming the semiconductor packaged system. The RGA interposer includes a substrate having vias and zones, where the zones have embedded heaters. The heaters may include first traces, second traces, and via filament interconnects. The vias may have a z-height greater than a z-height of the heaters, and each of the zones may have a grid pattern. The RGA interposer may include first and second layers in the substrate, where the first layer includes the first traces, the second layer includes the second traces, and the second layer is over the first layer. The grid pattern may have parallel first traces orthogonal to parallel second traces to form a pattern of squares, where the pattern of squares has the first traces intersect the second traces substantially at right angles.

A board, including a first pad area, a second pad area, a first micro heater, a second micro heater, a first heater terminal pad, a second heater terminal pad, and a third heater terminal pad, is provided. The first pad area and the second pad area respectively include at least one pad. The first micro heater and the second micro heater are respectively disposed corresponding to the first pad area and the second pad area. The first heater terminal pad and the second heater terminal pad form a loop with the first micro heater by being electrically connected to an outside, so that the first micro heater generates heat. The second heater terminal pad and the third heater terminal pad form another loop with the second micro heater by being electrically connected to the outside, so that the second micro heater generates heat. A circuit board and a fixture are also provided.

A circuit board is disclosed that has a pre-warming function. The circuit board includes a substrate and one or more conductive paths embedded in the substrate. The one or more electrically conductive paths include a logic control circuit containing a heating element and a temperature-sensitive element configured to control the heating element and deliver an input when the temperature-sensitive element has reached a threshold temperature. The one or more electrically conductive paths further includes a heater power circuit configured to deliver power to the logic control circuit. The one or more electrically conductive paths further includes an operational power circuit configured to switch off power to the heater power circuit and switch on power to the operational power circuit upon a delivery of the input from the logic control circuit.

Embodiments include interposers for use in high speed applications. In an embodiment, the interposer comprises an interposer substrate, and an array of pads on a first surface of the interposer substrate. In an embodiment, a plurality of vias pass through the interposer substrate, where each via is electrically coupled to one of the pads in the array of pads. In an embodiment a plurality of heating elements are embedded in the interposer substrate. In an embodiment a first cable is over the first surface interposer substrate. In an embodiment, the first cable comprises an array of conductive lines along the first cable, where conductive lines proximate to a first end of the cable are electrically coupled to pads in the array of pads.

It is proposed to provide a transfer method of a high viscosity functional material, such as a conductive paste, onto a receiving substrate, the method comprising the steps of: providing a plate having a cavity surface that includes at least one cavity; providing the cavity with a resistive heating device and control circuitry connected to the heating device; providing a functional material in the at least one cavity, having a material composition that, when heated by the heating device, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the at least one cavity by the gas generation onto the receiving substrate.

A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically conductive resistive heating element upon a first core substrate. During a lamination cure PCB fabrication stage, a platen contacts the PCB and a power supply is electrically connected to the resistive heating element. The laminate is cured with heat transferred by the platen and heat from the resistive heating element. The PCB heating core may be located within an inner layer of the multi-layer PCB to normalize a thermal gradient across the multi-layer PCB that may otherwise occur during the laminate cure fabrication stage. As a result of the normalized thermal gradient, the degree of laminate cure and material characteristics of the cured laminate material are more consistent throughout the multi-layer PCB thickness.

An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.

A shaping method includes a first ejection step of ejecting a first curable viscous fluid, a planarization step of planarizing the first curable viscous fluid, a first curing step of curing the first curable viscous fluid, a cured layer forming step of repeatedly executing the first ejection step, the planarization step, and the first curing step to form a cured layer, a second ejection step of ejecting a second curable viscous fluid onto a surface of the cured layer, a second curing step of forming a smooth surface on the surface of the cured layer by curing the second curable viscous fluid, a third ejection step of ejecting a fluid containing metal particles onto the smooth surface, and a third curing step of curing the fluid containing the metal particles ejected in the third ejection step to form a metallic conductor on the smooth surface.

A lithium-ion battery assembly configured to provide electric power to a vehicle. The battery assembly includes a plurality of battery cells interconnected to provide a combined electrical potential between positive and negative terminals of the battery assembly, and a printed circuit board assembly (PCBA) disposed adjacent to a first array of battery cells of the plurality of battery cells. The PCBA includes a collector plate electrically coupled with the first array of battery cells, a temperature sensor configured to obtain temperature readings, a plurality of heaters configured to generate heat using electrical power, and an assembly processor. The assembly processor is configured to obtain readings from the temperature sensor, determine an estimated battery cell temperature, and initiate a heating program by delivering electrical power to the plurality of heaters from an electrical power source when the estimated battery cell temperature is below a threshold.

The storage device unit includes: a substrate having a main surface and having a plurality of wiring layers stacked together; and a storage device that has a plate shape having a first surface and is disposed on the substrate, the first surface facing the main surface. The plurality of wiring layers includes a heat-generating layer having a heat-generating circuit.