Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

A method and system for manufacturing a workpiece is disclosed. The method comprises providing (810) a layer (120) of a polymeric material on at least a portion of a substrate (110) and patterning (830) the layer of polymeric material by exposing the layer with electromagnetic radiation having a frequency and amplitude within said certain frequency range and amplitude range so as to form a pattern of regions (122) having a first electrical conductivity and regions (124) having a second electrical conductivity. The method further includes the actions of mounting (840) an electronic component (140) on the layer of polymeric material and curing (850) the polymeric material. A workpiece comprising a substrate (110), a layer (120) of a polymeric material adapted to, in a non-cured state, to change its electrical conductivity when exposed with electromagnetic radiation (E) within a certain frequency and amplitude range is also disclosed.

Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

The present disclosure provides a patterned electrode, a method for forming a patterned electrode and a display device. The patterned electrode includes: a conductive pattern formed of a conductive material; and an insulation pattern provided in a same layer as the conductive pattern and formed of an insulation material which is transformed from the conductive material.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

A printed wiring board includes a first layer comprising a first plurality of conductive graphene traces and insulating graphane arranged to separate the first plurality of conductive graphene traces. The printed wiring board also includes a second layer and a third layer. The second layer includes an insulating layer. The third layer includes a second plurality of conductive graphene traces and insulating graphane arranged to separate the second plurality of conductive graphene traces. The second layer is disposed between the first layer and the third layer.