Disclosed are an electrical connection method for an electronic element, and a backlight module, a display panel, and a display apparatus which include an electronic element to which the electrical connection method is applied. The electrical connection method comprises: providing a driving back plane, wherein the driving back plane comprises multiple contact electrodes; forming an anti-oxidation protection film on the contact electrodes; coating a position of the anti-oxidation protection film corresponding to each contact electrode with a binding material; and transferring multiple electronic elements to the positions of the corresponding contact electrodes, binding each electronic element to the corresponding contact electrode, and removing the anti-oxidation protection film at the position of each contact electrode before completing the binding of each electronic element to the corresponding contact electrode.

Provided is a liquid mixture for filling blind holes in copper foil, relating to the technical field of electroplating hole filling. The liquid mixture comprises copper sulfate pentahydrate 210-240 g/L, citric acid 40-50 g/L, tartaric acid 10-20 g/L, chloride ion 40-70 ppm, accelerator 0.5-2 g/L, leveling agent 5-15 g/L, inhibitor 5-10 g/L, and sulfonate ion liquid 50-180 g/L. The leveling agent comprises tetranitro blue tetrazolium blue and triazolyl acetyl hydrazide.

The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.

The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.

A water-based organic solderability preservative includes (A) an imidazole compound, (B) an organic acid, (C) a complex coating formation aid, (D) an organic solvent and (E) water. The component (D) (organic solvent) has a solubility to water of 10 g/100 g or more at 20 degrees C. and a boiling temperature in a range from 100 degrees C. to 300 degrees C.

The present invention is related to a composition for micro etching of a copper or a copper alloy surface, wherein the composition comprises i) at least a source of Fe.sup.3+ ions, ii) at least a source of Br.sup.− ions, iii) at least an inorganic acid, and iv) at least one etch refiner according to formula I

##STR00001## wherein R1 is selected from the group consisting of hydrogen, C.sub.1-C.sub.5-alkyl or a substituted aryl or alkaryl group; R2 is selected from the group consisting of hydrogen, C.sub.1-C.sub.5-alkyl or C.sub.1-C.sub.5-alkoxy; R3, R4 are selected from the group consisting of hydrogen and C.sub.1-C.sub.5-alkyl; and X.sup.− is a suitable anion. Further, the present invention is directed to a method for micro etching of copper or copper alloy surfaces using such a composition.

A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. ##STR00001## In Formula (1), n represents 0 to 10, Z represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group.

Disclosed herein is a method of forming vias in electrical laminates comprising laminating a sheet having a layer comprising a crosslinkable polymer composition to a substrate wherein the crosslinkable polymer composition has a viscosity at lamination temperatures in the range of 200 Pa-s to 100,000 Pa-s, forming at least one via in the crosslinkable polymer layer by laser ablation; and after the forming of the at least one via, thermally curing the crosslinkable polymer layer. According to certain embodiments the cross linkable polymer composition has a viscosity at lamination temperature of at least 5000 Pa-s. This method yields good lamination results, good via profiles, and good desmear results when such compositions are used and the via is laser ablated before cure.

The present invention relates to a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material comprising as a main step contacting of at least one section of said metal, metal alloy or metal oxide with a specific azole silane compound, a specific azole silane oligomer, or a mixture comprising said compound and/or said oligomer. Furthermore, the present invention relates to a use of said specific azole silane compound, said specific azole silane oligomer, or said mixture in a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material.

A fabrication method of an electronic device bonding structure includes the following steps. A first electronic component including a first conductive bonding portion is provided. A second electronic component including a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. Bonding is performed on the first electronic component and the second electronic component through the first conductive bonding portion and the second conductive bonding portion, such that the first electronic component and the second electronic component are electrically connected. The first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion after the bonding. An electronic device bonding structure is also provided.