Provided is a method for populating printed circuit boards, which includes the steps of registering jobs in each case relating to the population of a number of printed circuit boards of a printed circuit board type with components of predetermined component types, assigning printed circuit board types of the registered jobs to a predetermined number of fixed set-up families, optimizing the assignment in such a way that a characteristic number relating to all the pick-and-place lines of the pick-and-place system is optimized as far as possible, and populating the printed circuit boards on one of the pick-and-place lines by using one of the fixed set-ups.

Described herein is an electronics circuit board design tool. The tool includes a substantially planar non-conductive substrate adapted to be positioned on an electronics breadboard. The substrate includes a plurality of guide apertures at locations corresponding to predefined electrical inputs of the breadboard such that electronic components are able to be connected to the electronics breadboard through respective ones of the guide apertures. The tool also includes indicia printed on a surface of substrate. The indicia is indicative of the type or position of electrical connections or components to be connected with the breadboard through corresponding ones of the guide apertures.

An assembling method for a multi-core cable having a plurality of electrical insulated wires is designed to connect one-end-portions of the electrical insulated wires to electrode patterns, respectively, of one circuit board, correspondingly connect other-end-portions of the electrical insulated wires to electrode patterns, respectively, of the other circuit board, compute intersection coefficients on one end side and the other of the cable, and iterate interchanging connecting destinations for the one-end-portions of the electrical insulated wires, correspondingly interchanging connecting destinations for the other-end-portions of the electrical insulated wires, and computing the intersection coefficients on the one end side and the other of the cable. The connecting destinations for the electrical insulated wires to the electrode patterns are determined in such a manner that a maximum intersection coefficient denoting either larger one of the respective intersection coefficients of the one end side and the other of the cable is made small.

A board design assistance device includes a design data acquirer to acquire design data for a printed circuit board, a first determiner to determine, based on the design data for the printed circuit board, whether a lengthwise direction of board fiber in the printed circuit board is perpendicular to a longitudinal direction of an electronic component mounted on the printed circuit board, a second determiner to determine, based on the design data for the printed circuit board, whether a wire is routed crosswise from a pad receiving the electronic component mounted on the printed circuit board, and a notifier to provide a notification including error information specifying an electronic component determined to have a longitudinal direction not perpendicular to the lengthwise direction of the board fiber and determined to be connected to a pad from which a wire is not routed crosswise.

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

A system and a method are disclosed for placing hardware components on a printed circuit board (“PCB”) in a way that enables all hardware components on the PCB to be passively cooled without using active cooling systems. Components are selected to be placed onto the PCB and heat metrics for each component is obtained (e.g., from a server). The components are ranked based on the amount of heat that each component generates. A corresponding position for each of the hardware components is determined based on the ranking of the components and the orientation of the PCB. The placement is based on the concept that air having higher temperature rises while air having cooler temperature falls. A representation of the PCB according to corresponding positions of the hardware components may be generated for display.

Inter-alia, a method for manufacturing a three-dimensional light emitting appliance is disclosed, said method comprising: providing a first data model of a three-dimensional area; arranging a plurality of spots for light emitting devices on the three-dimensional area of the first data model, wherein the plurality of spots is substantially evenly distributed over at least a part of the three-dimensional area; transforming the first data model of the three-dimensional area comprising the spots into a substantially two-dimensional and flat second data model, wherein the position of the spots on the second data model is derived; manufacturing a printed circuit board in accordance with the second data model and arranging pads of the printed circuit board on the spots of the second data model; equipping the pads of the printed circuit board with light emitting devices; and bringing the printed circuit board into the shape of the three-dimensional area. Further, a three-dimensional light emitting appliance is disclosed.

One aspect provides a printed circuit board (PCB). The PCB includes a transmission line to transmit signals of a desired frequency, a first stub coupled to the transmission line at a first location, and a second stub coupled to the transmission line at a second location. The first stub is to filter out signals of a first frequency, the second stub is to filter out signals of a second frequency, and the first and second stubs are positioned such that an insertion loss of the transmitted signals of the desired frequency is substantially minimized.

An object here is to provide a control device which can be reduced in size, weight and cost while being able to prevent unauthorized access. The control device includes: a microcontroller having a storage device, a processor, a package in which the storage device and the processor are accommodated, and multiple communication electrodes provided on a bottom surface of the package; and a wiring board having wiring layers comprised of a front surface layer, an intermediate layer and a rear surface layer, each having a wiring pattern formed therein, insulating members for insulating the respective wiring layers from each other; interlayer connection portions each making an electrical connection between the wiring patterns in different ones of the wiring layers; multiple electrode pads formed n the front surface layer; and communication-dedicated interlayer connection portions which are electrically connected to the respective electrode pads, and which are each externally exposed.

A method and system for manufacturing a coil for wireless charging are disclosed herein. The method may include manufacturing a printed circuit board, generating a coil-shaped metal pattern on the printed circuit board, and generating an additional metal pattern on the top of the metal pattern using a 3D metal printer.