A reliable electronic circuit board is provided, which maintains the quality and electrical conduction of an electronic circuit thereof even if being produced at an ordinary temperature at an atmospheric pressure. The electronic circuit board includes an ink receiving layer formed from a resin composition containing a polyvinyl acetal resin as a main component, and an electronic circuit formed in a pattern from an electrically conductive ink. An electronic circuit board production method includes the steps of: applying a liquid resin composition containing a polyvinyl acetal resin as a main component to form a layer of the liquid resin composition; heat-drying the liquid resin composition to form an ink receiving layer; and forming an electronic circuit in a predetermined circuit pattern from an electrically conductive ink by a printing method or a transferring method.

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

There is provided a method which includes placing a component on a substrate and extending an alignment member through an opening in the substrate. Once the alignment member is extended through the opening, the component is moved to abut against the alignment member to align the component relative to the substrate. After the component is aligned relative to the substrate, the component is secured to the substrate and the alignment member is retracted through the opening.

A circuit board clamp includes a clamp frame having a first and second frame supports. The clamp frame also includes a top plate arranged between the first and second frame supports. The top plate supports a piston via a threaded fastener engaging a top plate aperture. The piston may be displaced relative to the top plate in accordance with adjustment of the threaded fastener. A pressure plate assembly has a pressure plate and a stem attached to the pressure plate. The stem is positioned within a tubular section of the piston, and the pressure plate is positioned opposite the circuit board from the heat sink. The pressure plate contacts a surface mounted integrated circuit between the circuit board and the pressure plate. A bias member is seated on the bias seat and applies a biasing force on the pressure plate.

A circuit board includes an interconnect and an insulating layer that covers the interconnect. The interconnect includes a first interconnect that is formed to serve as a recognition mark of which planar shape is a predetermined shape. The insulating layer has a through-hole of which planar shape is variant and that penetrates the insulating layer in a thickness direction of the insulating layer such that an entire upper surface of the first interconnect is exposed. The through-hole includes a first through-hole of which planar shape is a predetermined shape and that penetrates the insulating layer in the thickness direction such that the entire upper surface of the first interconnect is exposed and a second through-hole that serves as part of an inner wall surface of the first through-hole and that penetrates the insulating layer in the thickness direction.

The invention relates to a support pin (10) for supporting a substrate (80) in a placement area of a placement machine (100) and a placement machine (100) with at least one placement head (101), a magazine (104) with a plurality of such support pins (10) and a placement board (103).

A connection method for a chip and a circuit board includes: placing the circuit board on the chip, the circuit board having a first surface in contact with the chip having a plurality of contacts, and the circuit board having a plurality of through holes aligned with the plurality of contacts respectively; placing a mask on a second surface of the circuit board, the mask having a plurality of openings aligned with the plurality of through holes respectively; covering a surface of the mask with a conductive adhesive to fill the plurality of through holes with the conductive adhesive; and keeping portions of the conductive adhesive that are respectively in the plurality of through holes to be spaced apart from each other. The portions of the conductive adhesive that fill the plurality of through holes remain to provide an electrical connection between the circuit board and the chip.

A stencil printer for printing an assembly material on an electronic substrate includes a frame, a stencil coupled to the frame, the stencil having apertures formed therein, a support assembly coupled to the frame, the support assembly being configured to support the electronic substrate, a print head gantry coupled to the frame, and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The stencil printer further comprises a verification system to determine whether an item placed within the stencil printer is properly installed within the stencil printer.

An image sensor attached to a printed circuit board is installed in a camera. A holder includes first and second rails comprising first and second printed circuit boards, respectively, and the holder is fastened to a lens mount of the camera. The holder may be fastened to captively hold the image sensor, and the image sensor may be resiliently supported when captively held. A gripper grasps the image sensor proximate to the holder and aligns the image sensor to an aligned position of the image sensor relative to the lens mount. The image sensor may be moved to the aligned position after directing an image toward the image sensor to produce a processed image for determining relative alignment. The printed circuit board is soldered to the first and/or second printed circuit board such that the holder fixedly holds the image sensor so it is unmovable in its aligned position.

A universal pin production support device provides a resettable surface mount carrier that eliminates the need for single assembly tooling. The design of the UPPS allows for it to be custom set to fix and support each specific circuit board or assembly.