An IC unit unloading system including a chute and a drawer. The chute has a plurality of channels each arranged to receive a unit. The drawer is arranged to move along the chute and has a gate with a unit contact face proximate a top surface of the chute. The contact face is arranged to draw the units along the respective channel as the drawer moves along the chute, and to allow the units to slide laterally across the contact face from a first pitch of each channel to a second pitch. A method for washing a plurality of PCB units, the method comprising the steps of: receiving a plurality of PCB units, said PCB units arranged with a bump face projecting downwards; washing the bump face of the PCB units, then; flipping the PCB units so as to project the ball face downwards, then; washing the ball face.

Forming, in a printed-wiring board, a via sufficiently filled without residual smear, for use in an insulating layer and the size of the via to be formed. A via of a printed-wiring board comprises a first filling portion which fills at least a center portion of a hole, and a second filling portion which fills a region of the hole that is not filled with the first filling portion. An interface which exists between the second and first filling portions, or an interface which exists between the second filling portion and an insulating layer and the first filling portion has the shape of a truncated cone comprising a tapered surface which is inclined to become thinner from a first surface toward a second surface, and an upper base surface which is positioned in parallel to the second surface and closer to the first surface than to the second surface.

Disclosed in a reel-to-reel surface press apparatus. The reel-to-reel surface press apparatus includes an uncoiler and a recoiler, both transferring a component in a reel-to-reel method, a press disposed between the uncoiler and the recoiler, comprising a press plate pressing the component, and having a plurality of reference holes at an equal pitch along an edge of the press plate, a feeder disposed at the rear of the uncoiler and moving the component, and a controller configured to control the component to be transferred based on at least any one of the plurality of reference holes.

Description of a method and equipment for panel (900) treatment in the manufacture of printed circuit boards that includes the following phases: setting up a panel (900) with a first side (905), a second side (910) opposite the first side, and at least one through hole (915) in the thickness of the panel; positioning the opening (205) for an intake system (200) in contact with the first side (905) of the panel (900) so this opening (205) delimits a portion on the first side (905) containing the through hole (915); creating negative pressure within the intake system (200) and simultaneously exposing at least one portion on the second side (910) of this panel (900) to a flow of plasma, whereby this portion on the second side (910) contains the through hole (915).

A wiring substrate includes a first wiring layer, an insulative resin first insulation layer covering the first wiring layer, and a second wiring layer located on an upper surface of the first insulation layer. A via wiring layer, which extends through the first insulation layer to connect the first and second wiring layers, includes an upper end surface connected to the second wiring layer and flush with the upper surface of the first insulation layer. The second wiring layer has a higher wiring density than the first wiring layer. The first insulation layer includes a first resin layer and a second resin layer located on an upper surface of the first resin layer and having a lower filler content rate than the first resin layer. The upper surface of the first resin layer is a curved surface upwardly curved toward the upper end surface of the via wiring layer.

A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.

A multilayer printed wiring board and a method of manufacturing the same are provided. A multilayer printed wiring board of the present embodiment includes: a core base material formed by laminating a first wiring layer and a first insulating layer in this order on an insulating substrate; and a built-up layer formed by laminating a second wiring layer and a second insulating layer in this order on the core base material. A primer layer is formed between the second wiring layer and the first insulating layer, the second wiring layer has a lower surface at least part of which is in contact with the primer layer, and the second wiring layer has an upper surface and a side surface on both of which a tin-plated layer and a silane coupling layer are formed in this order.

To provide a method for manufacturing a laminate body with excellent heat resistance (solder heat resistance, for example) and excellent conduction reliability in which a small diameter via hole can be formed. RESOLUTION MEANS To provide a manufacturing method of a laminate body, containing: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the aforementioned curable resin composition with a supporting body onto a substrate on a curable resin composition layer forming surface side to obtain a pre-cured composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the aforementioned composite and thermally curing the aforementioned curable resin composition layer to form a cured resin layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the aforementioned supporting body side of the aforementioned cured composite with a supporting body to form a via hole in the aforementioned cured resin layer; a step of peeling the aforementioned supporting body from the aforementioned cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer a step of removing resin residue in the via hole of the aforementioned cured composite; a step of performing a second heating of the aforementioned cured composite; and a step of forming a conductor layer on an inner wall surface of the via hole of the aforementioned cured composite and on the aforementioned cured resin layer.

Problem: To provide a method for manufacturing a laminate body with excellent heat resistance (solder heat resistance, for example), in which a small diameter via hole can be formed. RESOLUTION MEANS: The provision of a manufacturing method of a laminate body, containing: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the aforementioned curable resin composition layer with a supporting body onto a substrate on a curable resin composition layer forming surface side to obtain a pre-curing composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the aforementioned composite and thermally curing the aforementioned curable resin composition layer to form a cured resin layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the aforementioned supporting body side of the aforementioned cured composite with a supporting body to form a via hole in the aforementioned cured resin layer; a step of peeling the aforementioned supporting body from the aforementioned cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer, a step of performing a second heating of the cured composite; a step of removing resin residue in the via hole of the aforementioned cured composite; and an step of forming a conductor layer on an inner wall surface of the via hole of the aforementioned cured composite and on the aforementioned cured resin layer; wherein the forming of the conductor layer in the via hole is performed via electroless plating or a combination of electroless plating and electrolytic plating.

Provided herein is a method for forming a transparent electrode film for display and the transparent electrode film for display, the method comprising forming an electrode pattern by printing a fine electrode pattern on a release film using a conductive ink composition; forming an insulating layer by applying an insulating resin on the release film on which the electrode pattern has been formed; forming a substrate layer by laminating a substrate on the insulating layer; and removing the release film.