This application discloses a method for laminating display panel, a control device for laminating display panel, and a vacuum laminator; the method comprising: conducting a vacuumization at the time of a 1st rough alignment for a 1st substrate and a 2nd substrate put into an enclosed cavity; stopping vacuumization at the time of a 2nd rough alignment for the two.

A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

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A multi-layer material comprises a textile substrate layer, a functional layer arranged on the textile substrate layer, and a coating covering the functional layer and the textile substrate. The multi-layer material further includes a textile cover layer arranged between the functional layer and the coating. An adhesive layer is arranged between the functional layer and the textile cover layer. The textile substrate is woven or knitted from one yarn and the textile cover layer is woven or knitted from an identical yarn.

A portable electronic device includes a housing member. The portable electronic device also includes a front cover coupled to the housing member and defining a top surface defining a portion of an exterior front surface of the portable electronic device, a bottom surface opposite the top surface, a peripheral side surface, and a chamfered edge extending from the bottom surface to the peripheral side surface. The portable electronic device further includes a display stack attached to the bottom surface of the front cover, an opaque coating positioned on at least a portion of each of the peripheral side surface, the chamfered edge, and the bottom surface and configured to absorb light emitted by the display stack, and a rear cover coupled to the housing member and defining a second portion of the exterior rear surface of the portable electronic device.

Methods, systems, devices, and products for constructing a downhole tool electronics module. Methods may include creating a circuit board by metallizing at least part of a first surface on a first side of a substrate to define at least one metallized area on the first surface, wherein the substrate comprises a ceramic material and includes: the first side, including at least (i) the first surface, and (ii) an elevated surface elevated from the first surface, and a second side opposite the first side; flattening at least partially the elevated surface to a predefined first flatness to create a mounting portion by removing material from the elevated surface; attaching an electronics component to the first surface; and mounting the circuit board on an electronics carrier by adhering at least part of the mounting portion to a mounting surface on the electronics carrier. Flattening at least partially the elevated surface to the predefined first flatness may be carried out by removing the material by areal grinding.

A human-like tactile perception apparatus for providing enhanced tactile information (feedback data) from an end-effector/gripper to the control circuit of an arm-type robotic system. The apparatus's base structure is attached to the gripper's finger and includes a flat/planar support plate that presses a pressure sensor array against a target object during operable interactions. The pressure sensor array generates pressure sensor data that indicates portions of the array contacted by surface features of the target object. A sensor data processing circuit generates tactile information in response to the pressure sensor data, and then transmits the tactile information to the robotic system's control circuit. An optional mezzanine connector extends through an opening in the support plate to pass pressure sensor data to the processing circuit. An encapsulating layer covers the pressure sensor array and transmits pressure waves generated by slipping objects to enhance the tactile information.

The invention relates to a method for manufacturing a component (1) comprising a printed circuit board (2) and a number of electrical components (3) arranged thereon. According to the invention, the electrical components (3) are pre-fixed on the printed circuit board (2), which is formed of plastic, by means of a fixing adhesive (9) and then completely encapsulated with an UV-adhesive (8).

Various embodiments may relate to a lighting module, including a first printed circuit board, on which at least one light source is arranged, a covering element, which at least partially covers the first printed circuit board, and a second printed circuit board, on which at least one electronic component is arranged, wherein the second printed circuit board is fastened to the covering element and is electrically connected to the first printed circuit board.

A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.

A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. At least part of the at least one electrically insulating layer structure comprises or consists of a material having a curing shrinkage value of less than 2%.