The capillary transfer technology presented here represents a powerful approach to transfer soft films from surface of liquid onto a solid substrate in a fast and defect-free manner. The fundamental theoretical model and transfer criteria validated with comprehensive experiments and finite element analyses, for the first time provides a quantitative guide and optimization for the choice of material systems, operating conditions and environments for scalable on-demand transfers with high yield. The intrinsically moderate capillary transfer force and externally selectable transfer direction offer robust capabilities for achieving deterministic assembly and surface properties of structures with complex layouts and patterns for potentially broad applications in the fabrication of flexible/stretchable electronics, surface wetting structures and optical devices. Integration of this technology with other advanced manufacturing technologies associated with material self-assembly, growth and layout alignment represents promising future topics and would help create emerging new manufacturing technologies that leverage unique fluidity of liquid environments.

Printed wiring board manufacturing method, and printed wiring board. The method includes preparing sheet material including cloth-like material woven of reinforced fiber with a 90 degree between warp thread and a weft thread; arranging the sheet material on a cutting-out apparatus so that the sheet material is tilted 5 to 30 degrees with respect to threads configuring the cloth-like material and cutting a portion to cross the cloth-like-material configuration threads aligned on a cutting blade at 5 to 30 degrees; cutting the sheet material from the tilted sheet material with the cut portion crossing the cloth-like-material configuration threads aligned on the cutting blade to form the sheet material with a circumferential edge of the sheet material crossing the cloth-like material configuration threads at 5 to 30 degrees; creating a mother laminate configured with the sheet material as an inner-layer board or an insulating board; and providing a conductor pattern on a metal layer of the mother laminate along a circumferential edge portion of the mother laminate.

The present invention describes a work vehicle component comprising a cavity obtained in the component, having an extension axis and delimited by a side wall, an opening for the cavity, placed at an outer surface of the component, a wear sensor housed in the cavity and comprising a first axial end placed at the opening for the cavity, a support body inserted into the cavity with a first axial end aligned with the first axial end of the wear sensor. The support body is connected to the side wall of the cavity and constrained to the side wall of the cavity, and the wear sensor is physically connected to the support body and is constrained, at least in an axial direction, to the support body.

The present invention relates to a solar panel to which a high-damping stacked reinforcement part is applied and, more specifically, to a solar panel to which a high-damping stacked reinforcement part is applied, comprising: a power generation unit for generating electrical energy; a coupling part to which the power generation unit is coupled, and which has a circuit formed therein; and a reinforcement part for reinforcing the rigidity of the coupling part and damping vibration to be transmitted, and thus the present invention can prevent the power generation unit from being damaged by vibration, or the solar panel from inducing wobbling of a satellite by failing to damp the vibration.

A semiconductor device including a semiconductor chip disposed on a substrate having a conductive pattern, an insulating plate and a metal plate that are sequentially formed and respectively have the thicknesses of T2, T1 and T3. The metal plate has a plurality of depressions formed on a rear surface thereof. In a side view, a first edge face, which is an edge face of the conductive pattern, is at a first distance away from a second edge face that is an edge face of the metal plate, and a third edge face, which is an edge face of the semiconductor chip, is at a second distance away from the second edge face. Each depression is located within a depression formation distance from the first edge face, where: 0<depression formation distance≤(0.9×T1.sup.2/first distance), and/or (1.1×T1.sup.2/first distance)≤depression formation distance<second distance.

A portable electronic device includes a housing, a display at least partially within the housing, a front cover coupled to the housing and positioned over the display, a rear cover coupled to the housing and defining a first portion of a rear exterior surface of the portable electronic device, a protrusion defining a sensor array region of the rear cover and a second portion of the rear exterior surface, and an internal surface opposite the second portion of the rear exterior surface. The portable electronic device also includes a sensor array mounted within the housing along the sensor array region and comprising a frame member coupled to the rear cover along the internal surface and defining a wall structure defining a first container region and a second container region, a camera module positioned in the first container region, and a depth sensor module positioned in the second container region and attached to the internal surface of the rear cover.

Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members. The method includes the steps of: laminating a laminate material LM including the support sheet 10 having the columnar metal members 14 formed thereon, a wiring board WB or a wiring board material WB′ having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16′ having a plurality of openings in portions corresponding to the columnar metal members 14 and containing a thermosetting resin such that the columnar metal members 14 are positioned in the respective openings; integrating the laminate material LM by heating and pressing to obtain a laminate LB including a thermosetting resin filled between an inner surface of each of the openings of the wiring board WB or the wiring board material WB′ and each of the columnar metal members 14; and peeling at least the support sheet 14 from the laminate LB.

A conductive transfer for application to a surface of a wearable item comprises a first non-conductive ink layer and a second non-conductive ink layer. An electrically conductive layer is positioned between the first non-conductive ink layer and the second non-conductive ink layer. The conductive transfer also comprises an adhesive layer for adhering the conductive transfer to the surface of the wearable item. The adhesive layer comprises a larger cross-sectional area than the cross-sectional area of each of the first non-conductive ink layer, the second non-conductive ink layer and the electrically conductive layer.

Provided is an automatic roll-to-roll quick press for flexible plates. The quick press comprises a lower film part and an upper film part parallel and movably attached to the lower film part. A right end of the lower film part is vertically connected to a transmission belt; a right end of the transmission belt is connected with a first pressing part; a top of the first pressing part is connected with a second pressing part; a second pressing plate part of the second pressing part comprises a flatness detection tube; there are four large infrared detectors inside the flatness detection tube, and four small infrared detectors inside; the detector scans a total of eight directions, and the scanning area covers the entire cylinder.

A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient E.sub.MD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient E.sub.TD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.