A circuit board includes a circuit substrate, at least one metal pad, and a tin bar corresponding to each of the at least one metal pad. Each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate. A surface of the metal pad facing away from the circuit substrate is recessed toward the circuit substrate to from a recess. The tin bar is received in the recess. A method for manufacturing a circuit board is also provided.

A reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a material which is moved while being wound and unwound by an uncoiler and a recoiler, and a clamp that is arranged so that a width direction of the material matches a lengthwise direction thereof, and is configured to fix the material, wherein the clamp includes a first clamp and a second clamp formed on opposite ends thereof, and a first-and-second clamp linkage formed between the first and second clamps.

The present invention relates to an assembly to be used in an inkjet printer, an inkjet printer and a method for printing. The assembly comprises (i) a first fixture configured to hold a first print head; and (ii) at least two processing lines A, B, C, D, wherein each processing line A, B, C, D includes a first printing section in which a functional layer is printed on a surface of an electronic device, a sintering section spaced apart from the first printing section and configured to sinter the functional layer, wherein the sintered functional layer exhibits a crystal lattice structure, and a transport mechanism (4) configured to move from the printing section to the sintering section. The first fixture is movable from one processing line A, B, C, D to another processing line A, B, C, D.

A screen printer comprising: a conveyance device configured to convey a board; a board holding device configured to position a conveyed board at a printing position; a stencil holding device configured to attach a stencil above the held board; a squeegee device configured to fill pattern holes of the stencil with solder paste; a board raising and lowering device configured to raise and lower the board positioned by the board holding device; and a control device configured to perform drive control of each the above devices, the control device including a standby printing processing section configured to raise the board from below with respect to the stencil such that the board contacts the stencil, stand by in a state with solder paste filled in the pattern holes, and lower the board to separate the board from the stencil in accordance with a board conveyance signal.

A circuit board includes a circuit substrate, at least one metal pad, and a tin bar corresponding to each of the at least one metal pad. Each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate. A surface of the metal pad facing away from the circuit substrate is recessed toward the circuit substrate to from a recess. The tin bar is received in the recess. A method for manufacturing a circuit board is also provided.

A cleaning apparatus is provided. This cleaning apparatus includes an inlet, an outlet, a first conveyance path, a second conveyance path, a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner, and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner. The first conveyance path and the second conveyance path are vertically arranged side by side. The second conveyance path is positioned above the first conveyance path and connected with the outlet at an end point. The second conveyance path functions as a stocker configured to temporarily store the target object.

A system for dispensing material on a substrate includes a dispensing unit having a dispensing piston. The dispensing piston is pneumatically driven from a first lower position to a second upper position. The system further includes a solenoid valve coupled to the dispensing unit, with the solenoid valve being configured to control air flow to and from the dispensing piston. The solenoid valve includes a solenoid coil and an amplifier connected to the solenoid coil. The system further includes a controller coupled to the amplifier, with the controller being configured to generate a command signal to the amplifier to control current in the solenoid coil.

There is provided a contact structure, comprising a substrate contact including a first contact portion that is located on a leading end side of the substrate contact and that comes into contact with a substrate and a second contact portion that is located nearer to a base end side of the substrate contact than the first contact portion; a seal member configured to cover a periphery of the substrate contact and to have a sealing surface that comes into contact with the substrate to seal the substrate contact; a first pressing portion configured to elastically apply a contact pressure on the substrate to the substrate contact; and a second pressing portion configured to come into contact with the seal member and to apply a contact pressure on the substrate to the seal member independently of the first pressing portion, wherein the first contact portion adheres to the seal member, and the second contact portion is fit in the seal member to be displaceable relative to the seal member.

A flexible substrate, a method of processing a flexible substrate and a system of processing a flexible substrate. The method of processing the flexible substrate includes: measuring a first expansion volume of the flexible substrate; and applying a first application pressure to the flexible substrate to laminate the flexible substrate on a base substrate; according to a first corresponding relationship between a first pressure applied to the flexible substrate and a compressive expansion volume generated by the flexible substrate in compression and according to the first expansion volume, the first application pressure is selected to allow a second expansion volume of the flexible substrate to at least partially compensate for the first expansion volume.

The objective of the present invention is to provide a precision filter which is suitable for filtering a circuit board production process liquid, which is extremely excellent in the resistance to both a strongly acidic cleaning liquid and a strongly alkaline cleaning liquid and which is extremely excellent in the capability of removing an extremely fine foreign substance. Also, the objective of the present invention is to provide a precision filter cartridge which is used for a circuit board production process liquid and which includes the precision filter. Further, the objective of the present invention is to provide a method for producing a circuit board using the process liquid filtered by the precision filter for a circuit board production process liquid or the precision filter cartridge for a circuit board production process liquid. The precision filter to filtrate a process liquid for producing a circuit board according to the present invention is characterized in comprising a tetrafluoroethylene copolymer (I) having an amino group in a side chain.