Systems and methods for venting a solvent are disclosed. The system includes a chamber, such as an oven having an interior volume defining a heating zone, where the interior volume receives at least one substrate coated with a coating material comprising a solvent. The system further includes a vent coupled to the oven and defining a passage between the interior volume and the environment external to the oven. The system also includes a solvent sensor measuring an amount of evaporated solvent present in the interior volume, and a fan removing at least a portion of the solvent from the interior volume. The system may also include a coating assembly including an applicator and a flow meter, wherein the applicator applies a portion of the coating material to the substrate, and the flow meter determines the amount of coating material applied to the substrate.

Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

The present invention relates to devices and methods for measuring a varnish jet for a varnishing process for electronic subassemblies. Said devices and methods allow the width and symmetry of the varnish jet to be determined without performing any relative movement between the varnish jet and the sensor.

A reel-to-reel circuit board manufacturing apparatus according to an embodiment of the present disclosure includes: a roller having a cylindrical shape, configured to rotate, and on which a substrate is wound; and a film body that is formed between the roller and the substrate to surround a surface of the roller and is rotatable, wherein the roller and the film body are separately rotated from each other.

Disclosed are an inkjet print system and an inkjet printing method using the same. An inkjet print system according to one embodiment of the disclosure may include a stage on which a printing medium is loaded and which moves the printing medium in a first direction, an inkjet head which moves in a second direction perpendicular to the first direction and in which a plurality of nozzles configured to eject an ink on the printing medium are formed, a measurement instrument which moves in the second direction independent of the inkjet head and measures a height for each section of an impacted coating layer on the printing medium, and a processor which allows the nozzles to be opened or closed on the basis of height information of the coating layer.

Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

An electronic component including: an electronic component body; at least one electrode on a surface of the electronic component body; and a cover layer having insulating properties on at least a part of a periphery of the electrode and extending across a boundary between the periphery of the electrode and the surface of the electronic component body, wherein the electrode includes, on the at least part of the periphery, a lower electrode closer to the surface of the electronic component body and an upper electrode on the lower electrode, the lower electrode extends more outward than the upper electrode to create a step at the at least part of the periphery of the electrode, and at the step at the periphery of the electrode, the cover layer extends from a surface of the upper electrode to a portion with no electrodes on the surface of the electronic component body.

A multilayer printed circuit board is provided. The multilayer printed circuit board includes a core, a first conductive layer coupled to the core, an insulating layer covering the first conductive layer, and a second conductive layer spaced from the first conductive layer by the insulating layer. The first conductive layer includes a first portion having a first thickness and a second portion having a second thickness greater than the first thickness. The second conductive layer is electrically coupled to the second portion of the first conductive layer by a conductive via extending through the insulating layer.

An injection molded article is provided with: a flat molded resin body that has a flat rectangular parallelepiped shape and is formed from an injection molded resin; and a base sheet affixed to the surface of the molded resin body. The base sheet has formed therein a first conductive layer on a first surface and a through hole passing through from the first surface to a second surface. The through hole is filled with a conductive material, and a second conductive layer is formed so as to be electrically connected with the first conductive layer via the conductive material with which the through hole is filled. In addition, a sealing material is formed on the first conductive layer so as to cover the through hole. The molded resin body is fixed together with the first surface side of the base sheet so as to cover the sealing material.