Method for producing an electrically conductive pattern on a substrate, wherein the method comprising the steps of forming an adhesive layer in a predetermined pattern on a substrate, adding electrically conductive solid particles onto the adhesive layer, wherein the particles stick onto the adhesive, heating the solid particles with electromagnetic radiation wherein the wavelengths of the electromagnetic spectrum are in the range 600-1400 nm, preferably in the range 700-1200 nm, such that the temperature of the particles exceeding their characteristic melting point, and pressing the heated particles against the substrate in a nip, wherein the particles are flattened, such that the particles electrically connect to each other and thereby form the conductive pattern.

A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.

A embedded passive structure, a microelectronic system, and an integrated circuit device assembly, and a method of forming the embedded passive structure. The embedded passive structure includes a base layer; a passive device attached to the base layer; a first power plane comprising metal and adjacent an upper surface of the base layer, the first power plane having a portion electrically coupled to a terminal of the passive device, wherein an upper surface of a combination of the first power plane and the passive device defines a recess; a second power plane comprising metal, the second power plane at least partially within the recess and having a lower surface that conforms with the upper surface of the combination; and a liner including a dielectric layer between the first power plane and the second power plane.

A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer includes Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 μm or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

The invention relates to a method for producing a substrate structured by nanowires, characterized in that no lubricant and no lithographic resist mask is used in the method, and only by moving a donor substrate having nanowires relative to a substrate and by locally tribological properties on the surface of the substrate, a specified number of nanowires is deposited selectively at locally defined points of the substrate. The invention further relates to a substrate that can be produced using the method according to the invention, and which selectively contains a specified number of nanowires on a surface at locally defined points. The invention further relates to the use of the substrate according to the invention in microelectronics, microsystems technology, and/or micro-sensor systems.

A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

An object of the invention is to provide: a two-phase alloy as a metal material that can be preferably utilized under circumstances of a temperature range and a high corrosion as in an oil well, the two-phase alloy having a high corrosion resistance and good mechanical properties that are equivalent or more than those of conventional ones, and saving a cost; a product of the two-phase alloy; and a method for producing the product. There is provided a two-phase alloy containing Cr as a major component and including two phases of an austenite phase and a ferrite phase in a mixed state. The alloy has a chemical composition containing: 34-70 mass % of Cr; 17-45 mass % of Ni; 10-35 mass % of Fe; 0.1-2 mass % of Mn; 0.1-1 mass % of Si; and impurities. The total content of the Ni and the Fe is 30-65 mass %.

According to one aspect of the present invention, a silver nanowire mesh (Ag NW-mesh) electrode and a fabricating method thereof. The Ag NW-mesh electrode includes a flexible substrate; and a mesh pattern layer which is disposed on the flexible substrate and in which a plurality of first meal lines and a plurality of second metal lines are composed of Ag NWs and intersect each other in an orthogonal or diagonal direction to form a grid pattern, wherein the first metal lines and the second metal lines of the mesh pattern layer form an angle of 35 degrees to 55 degrees with respect to a bending direction.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.