H05K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K3/10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K3/12
using; thick film techniques, e.g.; printing techniques to apply the conductive material; or similar techniques for applying conductive paste or ink patterns
H05K3/12
using; thick film techniques, e.g.; printing techniques to apply the conductive material; or similar techniques for applying conductive paste or ink patterns