H05K3/12

GRAVURE PRINTING PLATE
20230051478 · 2023-02-16 ·

A gravure printing plate capable of printing straight image lines with high accuracy. The gravure printing plate is a gravure printing plate for printing an image line including a straight image line constituted by a first contour line and a second contour line. The gravure printing plate includes a cell group including a reference cell for printing the first contour line, and image line composition cells present in a projection portion in which the reference cell is projected up to the second contour line in a direction orthogonal to the first contour line. The dimension of each cell of the reference cell and the image line composition cells in the same cell group in an extension direction of the first contour line is within ±5% of an arithmetic average value of the reference cell and the image line composition cells in the same cell group.

GRAVURE PRINTING PLATE
20230051478 · 2023-02-16 ·

A gravure printing plate capable of printing straight image lines with high accuracy. The gravure printing plate is a gravure printing plate for printing an image line including a straight image line constituted by a first contour line and a second contour line. The gravure printing plate includes a cell group including a reference cell for printing the first contour line, and image line composition cells present in a projection portion in which the reference cell is projected up to the second contour line in a direction orthogonal to the first contour line. The dimension of each cell of the reference cell and the image line composition cells in the same cell group in an extension direction of the first contour line is within ±5% of an arithmetic average value of the reference cell and the image line composition cells in the same cell group.

Printed wiring line, electronic device, touch panel, gravure plate, printed wiring line formation method, touch panel production method, and electronic device production method

A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.

Fine metal mask having protective portions having protective portion with ratio of thickness reduction equal to single pixel aperture ratio and method for manufacturing the same, mask frame assembly

The fine metal mask provided in the present disclosure includes at least one mask pattern portion, and at least one protective portion that is disposed on and connected with at least one side edge of the at least one mask pattern portion, wherein a thickness of the at least one protective portion is less than a thickness of the at least one mask pattern portion.

METHOD FOR PRODUCING A CONDUCTIVE PATTERN ON A SUBSTRATE
20230040740 · 2023-02-09 · ·

Method for producing an electrically conductive pattern on a substrate, wherein the method comprising the steps of forming an adhesive layer in a predetermined pattern on a substrate, adding electrically conductive solid particles onto the adhesive layer, wherein the particles stick onto the adhesive, heating the solid particles with electromagnetic radiation wherein the wavelengths of the electromagnetic spectrum are in the range 600-1400 nm, preferably in the range 700-1200 nm, such that the temperature of the particles exceeding their characteristic melting point, and pressing the heated particles against the substrate in a nip, wherein the particles are flattened, such that the particles electrically connect to each other and thereby form the conductive pattern.

WATER-REDISPERSIBLE GRAPHENE POWDER
20230012274 · 2023-01-12 ·

The invention described herein provides a dry graphene powder composition comprising pristine graphene flakes, wherein the pristine graphene flakes are non-covalently functionalised with polymeric amphiphilic molecules and wherein the dry graphene powder composition is capable of forming a stable homogeneous dispersion in aqueous or alcoholic media, in the absence of free dispersants or stabilizers, as well as methods for producing same, and the use thereof in graphene inks, for 2D and 3D printing, for production of flexible circuits, electrodes, electrocatalysts, for fabrication of nanocomposites and for wet-spinning of pristine graphene fibers.

WATER-REDISPERSIBLE GRAPHENE POWDER
20230012274 · 2023-01-12 ·

The invention described herein provides a dry graphene powder composition comprising pristine graphene flakes, wherein the pristine graphene flakes are non-covalently functionalised with polymeric amphiphilic molecules and wherein the dry graphene powder composition is capable of forming a stable homogeneous dispersion in aqueous or alcoholic media, in the absence of free dispersants or stabilizers, as well as methods for producing same, and the use thereof in graphene inks, for 2D and 3D printing, for production of flexible circuits, electrodes, electrocatalysts, for fabrication of nanocomposites and for wet-spinning of pristine graphene fibers.

SYSTEMS AND METHODS OF 3D-PRINTING A CIRCUIT BOARD ON A HEAT SINK ASSEMBLY HAVING POWER DEVICES BONDED THERETO

A method of forming integrated power electronics packages by 3D-printing the PCB on and around power devices includes bonding a power device to a first surface of a cold plate and printing, using a 3D-printer, a circuit board on and around the power devices such that the circuit board includes one or more insulating portions and one or more conductive portions.

Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer
11596070 · 2023-02-28 · ·

An apparatus is used in preparing a printed circuit board (PCB). The apparatus can include a common chassis, an inkjet printer mounted on the common chassis, and a pattern exposer mounted on the common chassis. The inkjet printer can selectively print unexposed photosensitive patterns on a PCB substrate with a photosensitive ink. The pattern exposer can expose said photosensitive patterns to radiation thereby defining exposed patterns. A photosensitive ink for use in an ink jet printer can include a photoresist, a solvent, a humectant, a surfactant, an adhesion promoter, and a basic solution. The adhesion promoter is operative to increase anisotropy of a wet etching process of a copper component on which said photosensitive ink is printed.

Structures with deformable conductors

A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.