There is described a method of recovering parts of an electronic circuit having a self-supporting substrate having graphene oxide (GO) paper, and at least a conductive trace on the self-supporting substrate. The method generally has a step of immersing the electronic circuit into an environment-friendly solvent, the GO paper thereby dissociating from the conductive trace; and a step of recovering the GO paper from the environment-friendly solvent. The present disclosure also describes an electronic circuit generally having a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold; and at least a conductive trace on said self-supporting substrate. Further, there is also described a substrate for an electronic circuit in which the substrate generally has a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold.

There is described a method of recovering parts of an electronic circuit having a self-supporting substrate having graphene oxide (GO) paper, and at least a conductive trace on the self-supporting substrate. The method generally has a step of immersing the electronic circuit into an environment-friendly solvent, the GO paper thereby dissociating from the conductive trace; and a step of recovering the GO paper from the environment-friendly solvent. The present disclosure also describes an electronic circuit generally having a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold; and at least a conductive trace on said self-supporting substrate. Further, there is also described a substrate for an electronic circuit in which the substrate generally has a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold.

A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.

An article is described herein which comprises a substrate, a character sequence disposed on the substrate, a scratch-off coating disposed at least in part over at least one portion of the character sequence, and at least one conductive trace disposed at least in part over the at least one portion of the character sequence.

An article is described herein which comprises a substrate, a character sequence disposed on the substrate, a scratch-off coating disposed at least in part over at least one portion of the character sequence, and at least one conductive trace disposed at least in part over the at least one portion of the character sequence.

To provide a manufacturing method of a laminate body, including: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the curable resin composition onto a substrate on a curable resin composition layer forming surface side to obtain a pre-cured composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the pre-cured composite and thermally curing the curable resin composition layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the supporting body side of the cured composite with a supporting body to form a via hole in the cured resin layer; step of removing resin residue in the via hole of the cured composite with a supporting body; a step of peeling the supporting body from the cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer, and a step of forming a dry plated conductor layer by dry plating on an inner wall surface of the via hole of the cured composite and on the cured resin layer.

To provide a manufacturing method of a laminate body, including: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the curable resin composition onto a substrate on a curable resin composition layer forming surface side to obtain a pre-cured composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the pre-cured composite and thermally curing the curable resin composition layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the supporting body side of the cured composite with a supporting body to form a via hole in the cured resin layer; step of removing resin residue in the via hole of the cured composite with a supporting body; a step of peeling the supporting body from the cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer, and a step of forming a dry plated conductor layer by dry plating on an inner wall surface of the via hole of the cured composite and on the cured resin layer.

The invention relates to an electronic device comprising a printed circuit board (14) and comprising an electronic component (16) arranged on a first surface (15) of the printed circuit board (14). The printed circuit board (14) has a cutout (23) extending from a second surface (24) of the printed circuit board (14), said second surface being situated opposite the first surface (15), in the direction of the electronic component (16). The electronic device comprises a coolant container (25), which has an opening closed by the second surface (24) of the printed circuit board (14). The invention additionally relates to a method for producing such an electronic device.

The invention relates to an electronic device comprising a printed circuit board (14) and comprising an electronic component (16) arranged on a first surface (15) of the printed circuit board (14). The printed circuit board (14) has a cutout (23) extending from a second surface (24) of the printed circuit board (14), said second surface being situated opposite the first surface (15), in the direction of the electronic component (16). The electronic device comprises a coolant container (25), which has an opening closed by the second surface (24) of the printed circuit board (14). The invention additionally relates to a method for producing such an electronic device.

Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.