A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.

A positioning fixture including a shielding member and a driving member is provided. The shielding member includes a sliding part slidably connected to a functional module, a guiding part, and a shielding part. The sliding part and the shielding part respectively extend from two opposite ends of the guiding part. The driving member is movably disposed on the functional module corresponding to the shielding member. The driving member includes a base part, a driving part that contacts the guiding part, and a pillar part, which protrudes from the base part and is adapted to pass through the guiding groove. When the functional module is positioned on the circuit board, the base part of the driving member is pushed by the electronic component, and the guiding part is pushed by the driving part, so that the shielding member slides and the shielding part shields a screw hole of the circuit board.

A positioning fixture including a shielding member and a driving member is provided. The shielding member includes a sliding part slidably connected to a functional module, a guiding part, and a shielding part. The sliding part and the shielding part respectively extend from two opposite ends of the guiding part. The driving member is movably disposed on the functional module corresponding to the shielding member. The driving member includes a base part, a driving part that contacts the guiding part, and a pillar part, which protrudes from the base part and is adapted to pass through the guiding groove. When the functional module is positioned on the circuit board, the base part of the driving member is pushed by the electronic component, and the guiding part is pushed by the driving part, so that the shielding member slides and the shielding part shields a screw hole of the circuit board.

An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.

An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.

A method of manufacturing a component carrier includes forming a poorly adhesive structure on at least one layer structure, thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure, thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure, and forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure.

A method of manufacturing a component carrier includes forming a poorly adhesive structure on at least one layer structure, thereafter removing part of the poorly adhesive structure to thereby define a lateral limit of the poorly adhesive structure, thereafter attaching at least one further layer structure to the at least one layer structure and to the poorly adhesive structure, and forming a cavity by removing material of the at least one further layer structure above the poorly adhesive structure.

Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.

Disclosed is an assembly (11) of an electronic board (22) and a heat sink (24), in particular for a motor-fan unit (10) of a motor vehicle, comprising an electronic board (22); a heat sink (24) comprising a plate (28) fastened to the electronic board (22), the surface of which has through-openings (30); and a thermal paste (26) arranged between the electronic board (22) and the plate (28).

Disclosed is an assembly (11) of an electronic board (22) and a heat sink (24), in particular for a motor-fan unit (10) of a motor vehicle, comprising an electronic board (22); a heat sink (24) comprising a plate (28) fastened to the electronic board (22), the surface of which has through-openings (30); and a thermal paste (26) arranged between the electronic board (22) and the plate (28).