A terminal and a central electrical box are disclosed. The terminal is used to be mounted on a circuit board. The terminal comprises: a first termination part; a second termination part; and a bending part connected between the first termination part and the second termination part. The bending part is bent by a predetermined angle relative to the first termination part and the second termination part, so that the first termination part and the second termination part are staggered by a predetermined distance along a direction transverse to a direction of inserting the terminal to the circuit board. When the terminal is mounted on the circuit board, one of the first termination part and the second termination part passes through the circuit board. In the present invention, the terminal passes through the circuit board, so that two electronic devices located on both sides of the circuit board can be directly electrically connected through the terminal. Therefore, the number of terminals is reduced, and there is no need to set wiring for electrically connecting the terminals on the circuit board, which greatly reduces the cost.

An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Various embodiments relate to an electronic device including a foldable conducive plate. The electronic device may include: a foldable housing at least partially foldable via a hinge; a display including a flexible display panel viewable through a front surface of the foldable housing and being at least partially foldable, and a conductive plate disposed on a rear surface of the flexible display panel and supporting the flexible display panel; a circuit board disposed to face at least a portion of a border of the conductive plate in the foldable housing; and at least one conductive connection member comprising a conductor disposed between the conductive plate and the circuit board and electrically connecting the conductive plate and a ground of the circuit board.

Disclosed is a lamp with easy assembly and disassembly comprising a power socket and a lamp body. The power socket comprises a housing and a power supply assembly which is provided in the housing, the power supply assembly is connected with a power supply, the housing is provided with at least one mounting slot which is provided with a press-type locking socket and PCB probes, and the PCB probes are electrically connected with the power supply assembly, a mounting plug with an accommodating groove is provided on the lamp body, a press-type locking plug and a PCB board are provided in the mounting plug; the PCB board is electrically connected to the light source of the lamp body; when the mounting plug is inserted into the mounting slot, the push-type locking plug is inserted into the push-type locking socket and is locked.

A number of different sealed interfaces for power modules are described. In one example, a sealed interface includes a printed circuit board including a contact pad for power conduction to a bus bar of the printed circuit board, a semiconductor module including at least one power transistor, a terminal pin electrically coupled to the power module, and a housing for the power module. The housing includes an open terminal aperture that extends through the housing. The printed circuit board is seated upon the open terminal aperture, to close and seal the open terminal aperture, with the contact pad positioned within the open terminal aperture. The terminal pin contacts the contact pad of the printed circuit board within the open terminal aperture, and the open terminal aperture comprises a transitional feature to abate electric field intensity around an interface between the open terminal aperture and the printed circuit board.

The present disclosure provides a semiconductor module comprising a semiconductor device removably pressed-fit in a cavity formed in a printed circuit board and methods for manufacturing the same. The semiconductor device and the cavity of the printed circuit board can cooperate with each other and act as an electrical plug and an electrical socket respectively. Soldering the semiconductor device on the printed circuit board can be avoided. Therefore, the packaging process can be more flexible and reliability issues with solder joints can be eliminated. Moreover, heatsink can be mounted on top and/or bottom of the semiconductor device after being received in the cavity of the printed circuit board. Thermal dissipation efficiency can be greatly enhanced.

A circuit arrangement (1), in particular for an electrically driven motor vehicle, has at least one bus bar (5) which is connected electrically to a supplier (2) and which is connected to a first consumer (3) at a first transfer point (6) and to a second consumer (4) at a second transfer point (7). Both the first and the second transfer point (6, 7) are formed as flexible contact points.

A circuit board includes a magnetic shielding member having a first principal surface, and a second principal surface on an opposite side from the first principal surface, and a flexible wiring board having a first surface, and a second surface on an opposite side from the first surface. The second surface of the flexible wiring board is fixed to the first principal surface and the second principal surface of the magnetic shielding member. The first surface of the flexible wiring board includes a circuit area mounted with an electronic component, and one or more terminal areas where connection terminals are disposed. The circuit area is disposed above the first principal surface of the magnetic shielding member. The circuit board has a bent shape bent along the magnetic shielding member, so that the one or more terminal areas are disposed below the second principal surface of the magnetic shielding member.

The present application discloses a semiconductor device with an interface structure and a method for fabricating the interface structure. The interface structure includes an interface board configured to be fixed onto and electrically coupled to a chuck of a testing equipment, and a first object positioned on a first surface of the interface board and electrically coupled to the interface board. The first object is configured to be analyzed by the testing equipment.

Disclosed herein are various implementations of communications connectors. In some implementations, a communications plug may include a housing and a body positioned in the housing. A flexible printed circuit board (PCB) may be wrapped at least partially around the body, a and a plurality of metal contact pads may be positioned on the flexible PCB to mate with plug interface contacts (PICs) of a communications jack when the communications plug is inserted into the communications jack.