The invention is directed to a composite structure in which a metal member having a roughened surface and a resin member are joined in a state in which at least a portion of the roughened surface is included. The resin member is made of a molded article obtained by melt-molding a polyarylene sulfide resin composition containing a polyarylene sulfide resin. In the roughened surface, a cumulative pore volume of a pore diameter in a range of 0.1 μm to 20 μm is in a range of 0.5 nL/mm.sup.2 or more and 5 nL/mm.sup.2 or less measured by mercury porosimetry. According to the invention, it is possible to provide a composite structure that is obtained by joining a metal member and a molded article made of polyarylene sulfide resin composition and is more excellent in joining strength, heat cycle resistance, and sealing properties, and a method for producing the composite structure.

Provided is a plating lamination technology for providing a highly adhesive inner layer of a printed circuit board. The plating lamination technology is effective in providing an electroless plated laminate, including a non-etched/low-roughness pretreated laminate or a low-roughness copper foil, and a printed circuit board including the plated laminate.

A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, a cavity delimited at a bottom side at least partially by a top side of a stepped metal structure of the at least one electrically conductive layer structure, and a component embedded in the cavity and arranged on the stepped metal structure. A bottom side of the stepped metal structure has a flat surface extending continuously along at least one horizontal direction.

A sensing electrode includes a first electrode assembly, a second electrode assembly and a sealing component. The first electrode assembly includes an inner tubular body and a reference electrode component installed in the inner tubular body. The second electrode assembly includes an outer tubular body and a working electrode component installed in the outer tubular body. The first electrode assembly is installed in the outer tubular body. The sealing component is located between the inner and outer tubular bodies and provided to inhibit infiltration of an etching solution into the outer tubular body and leakage of an electrolyte from the inner tubular body. Thus, the sensing electrode has a better stability and service life.

A wiring substrate includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, a connection conductor penetrating through the insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer and adhering the first conductor layer and the insulating layer. The first conductor layer includes a conductor pad in contact with the connection conductor such that the conductor pad has a surface having a first region and a second region on second conductor layer side and that surface roughness of the first region is different from surface roughness of the second region, and the conductor pad of the first conductor layer is formed such that the first region is covered by the coating film and that the second region is covered by the connection conductor.

Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from −0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nm.sup.−1 to less than 0.0300 nm.sup.−1.

The present invention is related to a composition for micro etching of a copper or a copper alloy surface, wherein the composition comprises i) at least a source of Fe.sup.3+ ions, ii) at least a source of Br.sup.− ions, iii) at least an inorganic acid, and iv) at least one etch refiner according to formula I

##STR00001## wherein R1 is selected from the group consisting of hydrogen, C.sub.1-C.sub.5-alkyl or a substituted aryl or alkaryl group; R2 is selected from the group consisting of hydrogen, C.sub.1-C.sub.5-alkyl or C.sub.1-C.sub.5-alkoxy; R3, R4 are selected from the group consisting of hydrogen and C.sub.1-C.sub.5-alkyl; and X.sup.− is a suitable anion. Further, the present invention is directed to a method for micro etching of copper or copper alloy surfaces using such a composition.

A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 μm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.

An aqueous solution for surface treatment, for treating a surface of an alloy, the aqueous solution comprising: a copper compound at a copper ion concentration of 20000 ppm or more and 50000 ppm or less; a heterocyclic nitrogen compound at a concentration of 200 ppm or more and 3000 ppm or less; and a halide ion at a concentration of 2000 ppm or more and 70000 ppm or less.

A printed wiring board includes a first resin insulating layer, a second resin insulating layer formed on a surface of the first layer, and a conductor layer formed on the surface of the first layer such that the second layer is covering the conductor layer and that the conductor layer includes first, second, third, fourth, fifth, and sixth circuits such that the third and fourth circuits are sandwiching the first circuit and that the fifth and sixth circuits are sandwiching the second circuit. Widths between the first and third circuits and between the first and fourth circuits are 5 μm to 14 μm, and when a width between the second and fifth circuits and a width between the second and sixth circuits is 20 μm or more, the upper surface of the first circuit, and the upper surface and side walls of the second circuit are formed to have unevenness.